Air-Cavity Semiconductor Package with Embedded Heat Slug

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Solution Overview

Problem

Traditional semiconductor packages designed for higher power and frequency devices incur higher design and fabrication costs, necessitating a cost-effective packaging solution that can support these demands.

Innovation Solution

An air-cavity semiconductor package with a thermal carrier, ring structure, and package lid, featuring a heat slug, top and bottom coating layers, and carrier vias, where the heat slug is embedded in the carrier body and aligned with the ring structure's interior opening, allowing for efficient heat dissipation and reduced material costs through the use of organic laminate materials and copper-based components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional ceramic and metal packages with high-temperature brazing processes are used, then thermal management and structural strength are improved, but design and fabrication costs increase

Engineering Contradiction:

Improvethermal managementVSAvoiddesign and fabrication costs

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent changes the material parameters by substituting traditional ceramic and metal components with organic laminate materials that have appropriate thermal and mechanical properties. The organic laminate substrate with embedded heat slug provides thermal management capabilities while enabling lower-cost fabrication processes without high-temperature brazing

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures including organic laminate layers combined with metal heat slug and copper coating layers. This composite approach integrates the thermal conductivity benefits of metal with the cost and fabrication advantages of organic laminates, achieving both thermal management and cost reduction

Inventive Principle:

Principle #40Composite materials

2Power

If packages are adapted to support higher power and frequency devices, then device performance capability is improved, but design and fabrication costs increase

Engineering Contradiction:

Improvepower and frequency support capabilityVSAvoiddesign and fabrication costs

Core Design Contradiction:

PowerVSEase of manufacture

Solution Approach 1:

The patent segments the package structure into distinct functional layers: organic laminate substrate, embedded heat slug, copper coating layers, and semiconductor device. This segmentation allows each component to be optimized independently for its specific function while using cost-effective manufacturing processes for each layer

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent replaces expensive traditional ceramic and metal package components with more economical organic laminate materials that can achieve the required performance for higher power and frequency devices without the high fabrication costs of traditional approaches

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a cost-effective packaging solution for higher power and frequency semiconductor devices by enhancing thermal management and reducing material costs, while minimizing coefficient of thermal expansion mismatch between components.

Implementation Method 1

The heat slug resides in the carrier body and is surrounded by the carrier body. The top coating layer is formed over a top surface of the heat slug... efficient heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10872837B2Air-cavity semiconductor package with low cost high thermal carrier

Publication Date: 2020.12.22 QORVO US INC

AI summary

The present disclosure relates to an air-cavity semiconductor package, which includes a thermal carrier, a ring structure, a package lid, and at least one semiconductor device. The thermal carrier has a carrier body, a heat slug residing within the carrier body, a top coating layer formed over a top surface of the heat slug, and a bottom coating layer formed over a bottom surface of the heat slug. The ring structure includes a ring body with an interior opening, which resides over the thermal carrier, such that a portion of a top surface of the thermal carrier is exposed through the interior opening. The package lid resides over the ring structure and has a recess conjoined with the interior opening forming an enclosed cavity. The at least one semiconductor device is attached to the exposed portion of the top surface of the thermal carrier and encapsulated in the enclosed cavity.