Air-Cavity Waveguide Structure for Low-Loss Signal Transmission

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Solution Overview

Problem

Substrate integrated waveguide (SIW) structures experience significant energy loss during signal transmission, particularly at higher frequencies, due to the dielectric materials used, which limits their performance and increases implementation costs.

Innovation Solution

A waveguide structure is designed with an air cavity defined by a dielectric layer, circuit layers, and a conductor connection layer, reducing energy loss and allowing for high average power handling without being affected by external dielectric materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If dielectric material is used in SIW structure, then structural integrity and support are provided, but energy loss during signal transmission increases

Engineering Contradiction:
Improvesignal transmission lossVSAvoiddielectric material constraints
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The waveguide structure is segmented into distinct regions: an air-filled signal transmission cavity and dielectric support regions. The dielectric material is segmented to provide only structural support rather than being continuous throughout the signal path. This segmentation allows the signal to propagate through low-loss air while the dielectric material provides mechanical support where needed.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The dielectric material is extracted from the signal transmission path and replaced with air in the cavity region. Only the essential structural support function is retained in specific locations, while the harmful dielectric loss is eliminated from the signal propagation path. The air cavity is taken out as a distinct low-loss transmission medium.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If dielectric material is used in SIW structure, then mechanical support is provided, but signal transmission quality deteriorates at high frequencies

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidenergy loss
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

Different regions of the waveguide structure have different material qualities optimized for their specific functions. The air cavity region provides excellent electrical properties for signal transmission with minimal loss, while dielectric regions provide mechanical support. This local optimization of material properties ensures high signal quality in the transmission path while maintaining structural integrity where needed.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If conventional SIW structure is used, then ease of manufacture is maintained, but energy loss and power handling capability are limited

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidsignal transmission loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The invention merges the advantages of air-filled waveguides (low loss, high power handling) with the manufacturing simplicity of PCB-based SIW structures. The air cavity is integrated into the multi-layer PCB structure using standard fabrication techniques, combining the ease of printed circuit board manufacturing with the performance benefits of air-filled waveguide transmission.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11764451B2Waveguide structure
Publication Date: 2023.09.19 SUBTRON TECH
  • US11764451B2 patent drawing
  • US11764451B2 patent drawing
  • US11764451B2 patent drawing

AI summary

A waveguide structure includes a dielectric layer, a plurality of circuit layers, a plurality of insulation layers, and a conductor connection layer. The dielectric layer has an opening. The circuit layers are disposed on the dielectric layer. The insulation layers and the circuit layers are alternately stacked. The conductor connection layer covers an outer wall of the opening in a direction perpendicular to the circuit layers and connects at least two circuit layers on two opposite sides of the opening. At least the conductor connection layer and a part of the circuit layers define an air cavity for transmitting signals at a position corresponding to the opening.