Air cooled faraday shield and methods for using the same
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Solution Overview
Problem
In semiconductor manufacturing, Faraday shields in plasma etching chambers face issues with deposition buildup and temperature cycling, leading to flaking or peeling of coatings, which can result in particle contamination and defects on wafers, requiring frequent cleaning.
Innovation Solution
The implementation of an air-cooled Faraday shield system using a hub with a plenum to direct compressed dry air or amplified air flows, which reduces the temperature of the Faraday shield and minimizes thermal cycling by conducting heat away from the center region, thereby preventing deposition flaking and maintaining a stable operating temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the Faraday shield is used to block deposition onto the window, then the window is protected from particle contamination, but the Faraday shield itself accumulates deposition that flakes off over time
Solution Approach 1:
The harmful deposition accumulation is extracted from the Faraday shield by introducing a dedicated cooling system that actively removes heat and prevents deposition buildup on the shield surface, thereby eliminating the source of flaking particles
Solution Approach 2:
Cooling air is supplied to the Faraday shield before excessive deposition accumulation occurs, preventing the temperature rise that leads to flaking in the first place
2Productivity
If the Faraday shield is subjected to temperature cycling during etching processes, then the etching can be performed, but the deposition material flakes or peels off due to thermal expansion and contraction
Solution Approach 1:
The temperature parameter of the Faraday shield is actively controlled by introducing cooling air, maintaining it within a stable range that prevents thermal cycling-induced flaking while allowing the etching process to proceed
Solution Approach 2:
The cooling system provides continuous temperature regulation to the Faraday shield, creating a feedback mechanism that maintains stable operating conditions and prevents excessive temperature variations during etching cycles
3Temperature
If compressed dry air is supplied at high flow rates to cool the Faraday shield, then the temperature is reduced and flaking is prevented, but the system complexity and air consumption increase
Solution Approach 1:
The cooling system utilizes the existing compressed dry air infrastructure already present in the plasma processing chamber, eliminating the need for separate cooling equipment and reducing overall system complexity
Solution Approach 2:
The compressed dry air serves multiple functions: it provides cooling to the Faraday shield, maintains the inert atmosphere, and utilizes existing chamber infrastructure, thereby reducing the need for additional dedicated cooling systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the temperature of the Faraday shield, minimizing thermal cycling and preventing deposition flaking, thus reducing particle contamination and extending the interval between chamber cleanings, ensuring consistent and reliable semiconductor processing.
Implementation Method 1
reduces the temperature of the Faraday shield... by conducting heat away from the center region
Implementation Method 2
direct compressed dry air... flows, which reduces the temperature of the Faraday shield
Data Source
AI summary
A processing chamber and a Faraday shield system for use in a plasma processing chambers are provided. One system includes a disk structure defining a Faraday shield, and the disk structure has a process side and a back side. The disk structure extends between a center region to a periphery region. The disk structure resides within the processing volume. The system also includes a hub having an internal plenum for passing a flow of air received from an input conduit and removing the flow of air from an output conduit. The hub has an interface surface that is coupled to the back side of the disk structure at the center region. A fluid delivery control is coupled to the input conduit of the hub. The fluid delivery control is configured with a flow rate regulator. The regulated air can be amplified or compressed dry air (CDA).