Air-Cooled Semiconductor Power Module with Vertical Fin Heat Dissipation
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Solution Overview
Problem
Conventional power modules face challenges in efficiently cooling high heat generation density electronic materials, particularly in power conversion units for electric vehicles, where water-cooling systems are complex and heavy, necessitating the development of a lighter and more efficient cooling solution.
Innovation Solution
The implementation of an air-cooling type semiconductor apparatus with a thermal diffusion unit and multiple fin units connected to a thermal source, utilizing high thermal conductive materials and a vapor chamber to enhance heat dissipation, thereby reducing thermal resistance and simplifying the cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water-cooling type cooling apparatuses are used to suppress junction temperature, then heat dissipation performance is improved, but device complexity and weight increase due to tanks, pumps, and complex piping
Solution Approach 1:
The invention extracts and eliminates the complex water-cooling components (tanks, pumps, piping) from the cooling system, replacing them with a simplified air-cooling structure consisting of heat radiators directly coupled to the semiconductor device substrate, thereby reducing device complexity while maintaining heat dissipation capability
Solution Approach 2:
The invention replaces the mechanical water-cooling system with a passive or actively-driven air-cooling system using heat radiators with fin structures, substituting liquid-based thermal management with gas-based thermal management to simplify the overall system architecture
2Temperature
If water-cooling type cooling apparatuses are used to suppress junction temperature, then heat dissipation performance is improved, but weight becomes heavy due to tanks, pumps, and complex components
Solution Approach 1:
The invention removes heavy water-cooling components (tanks, pumps, extensive piping) from the system and replaces them with lightweight heat radiators that can be directly integrated onto the substrate, significantly reducing the overall weight of the cooling system
Solution Approach 2:
The invention changes the cooling medium from liquid (water) to gas (air), and modifies the thermal management approach from active liquid circulation to passive or actively-driven air flow through finned heat radiators, resulting in a lighter weight system
3Temperature
If heat radiators are arranged to radiate heat to the back surface side of the substrate, then heat dissipation is achieved, but space utilization is inefficient and heat dissipation performance is limited
Solution Approach 1:
The invention transitions from two-dimensional heat radiation at the substrate back surface to three-dimensional heat dissipation by extending heat radiators vertically upward from the substrate, creating a multi-layered fin structure that utilizes vertical space and provides significantly larger heat dissipation surface area within the same footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves high heat dissipation performance while minimizing weight, offering a more efficient and lightweight cooling solution for power modules, particularly in electric vehicle applications.
Implementation Method 1
a thermal diffusion unit thermally connected to the thermal source, the thermal diffusion unit including space in a direction opposite to the thermal source
Implementation Method 2
a plurality of fin units disposed in the space of the thermal diffusion unit, one end of the plurality of fin unit is connected to the thermal diffusion unit
Implementation Method 3
the plurality of fin units disposed in the space of the thermal diffusion unit
Implementation Method 4
utilizing high thermal conductive materials and a vapor chamber to enhance heat dissipation
Data Source
AI summary
The semiconductor apparatus includes: a thermal source TS including a semiconductor device generating heat in an operating state; a thermal diffusion unit thermally connected to the thermal source TS, the thermal diffusion unit including space in a direction opposite to the thermal source; a plurality of air-cooling fin units disposed in the space of the thermal diffusion unit, one end of the plurality of fin unit is connected to the thermal diffusion unit; and a base unit connected to the thermal diffusion unit, wherein the plurality of air-cooling fin units is connected to the base unit through a plurality of thermal contact units CP1, CP2, CP3, . . . , CPn. Provide is an air-cooling type semiconductor apparatus, power module, and power supply, each having high heat dissipation performance and realizing light weight.