Air Cooling System With Segmented Inlets And Blocking Pads
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Solution Overview
Problem
The existing air cooling systems in gaming laptops are bulky and inefficient, leading to increased thickness and weight, which compromises portability and effectiveness in preventing overheating.
Innovation Solution
An air cooling system with a body featuring heat dissipation ports and multiple air inlet ports, incorporating a thermal conduction component and a heat dissipation fan with radial air outlet openings, along with retractable stands and blocking pads to enhance air intake and prevent hot air recirculation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the air cooling system is made more complicated and bulky to enhance cooling, then the cooling efficiency is improved, but the thickness and weight of the electronic device increase
Solution Approach 1:
The cooling system is divided into multiple independent air inlet ports (first air inlet port and second air inlet port) positioned at different locations, with separate airflow paths leading to different regions of the heat dissipation fin array. This segmentation allows efficient heat dissipation through distributed airflow without requiring a bulky single-channel system
Solution Approach 2:
Air inlet ports are positioned at different spatial dimensions (front surface and side surface of the body), creating three-dimensional airflow paths that maximize cooling efficiency while maintaining a compact form factor. The heat dissipation fins are arranged in multiple layers to utilize vertical space efficiently
2Reliability
If the air cooling system is made more complicated and bulky to enhance cooling, then the cooling efficiency is improved, but the thickness of the electronic device increases
Solution Approach 1:
The cooling system uses multiple air inlet ports positioned at different locations (front and side surfaces) with separate airflow paths to different regions of the heat dissipation fin array, enabling efficient cooling without requiring increased device thickness
Solution Approach 2:
The system utilizes three-dimensional space by positioning air inlet ports at different spatial locations and arranging heat dissipation fins in multiple layers, maximizing cooling efficiency within the available thickness constraint
3Device complexity
If hot air recirculation occurs in the air cooling system, then the device structure becomes simpler, but the cooling effectiveness deteriorates
Solution Approach 1:
Blocking pads are strategically positioned at specific locations where hot air recirculation is most likely to occur, creating localized barriers that prevent hot air from re-entering air inlet ports. This targeted approach maintains cooling effectiveness without requiring complex system-wide modifications
Solution Approach 2:
Blocking pads serve as intermediary elements between the heat dissipation region and air inlet ports, physically separating the hot exhaust air flow from the cool intake air flow paths. These simple passive structures effectively prevent hot air recirculation without adding active control complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system improves cooling efficiency by increasing cold air intake, effectively distributing heat through the thermal conduction component, and preventing hot air recirculation, thus enhancing cooling performance and preventing overheating in electronic devices.
Implementation Method 1
The thermal conduction component is disposed in the body and configured to thermally contact a heat source
Implementation Method 2
A working fluid generated by the heat dissipation fan flows from the radial air outlet openings to the thermal conduction component in different directions
Data Source
AI summary
An air cooling system for electronic devices includes a body, a thermal conduction component, and a heat dissipation fan. The body has a heat dissipation port and air inlet ports. The air inlet ports are disposed at a first housing part and a second housing part of the body. The first housing part is opposite to the second housing part. The thermal conduction component is disposed in the body and configured to contact a heat source. The heat dissipation fan is disposed in the body. The heat dissipation fan includes a first axial air inlet opening, a second axial air inlet opening, and radial air outlet openings. The first axial air inlet opening corresponds to one of the air inlet ports of the first housing part. The second axial air inlet opening corresponds to one of the air inlet ports of the second housing part.