Air-Coupled PCB Antenna Sub-Array to Cut Signal Loss
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Solution Overview
Problem
Existing antenna structures in wireless communication systems face challenges with signal loss and increased manufacturing costs due to the use of transmission lines and multiple printed circuit board layers for sub-array configurations, which are necessary to increase antenna gain.
Innovation Solution
An antenna structure that connects antenna elements via air coupling, eliminating the need for transmission lines and reducing the number of stacked substrates, thereby minimizing signal loss and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If transmission lines are used to connect antenna elements in a sub-array configuration, then antenna gain can be increased, but signal loss increases and manufacturing cost increases
Solution Approach 1:
The patent removes transmission lines from the antenna structure, extracting the harmful component that causes signal loss. The antenna elements are directly coupled to each other through electromagnetic coupling in the air space, eliminating the need for physical transmission line connections and thereby reducing signal loss while maintaining antenna gain.
Solution Approach 2:
The patent introduces air space as an intermediary medium for electromagnetic coupling between antenna elements. Instead of using transmission lines as the coupling medium, the air space enables electromagnetic field interaction, allowing energy transfer without the losses associated with conductive transmission lines.
2Power
If multiple printed circuit board layers are stacked to form sub-array configurations, then antenna gain can be increased, but manufacturing cost increases
Solution Approach 1:
The patent segments the antenna structure into separate antenna elements that are spatially distributed and electromagnetically coupled, rather than requiring multiple stacked PCB layers. This segmentation allows for a simpler, single-layer or reduced-layer PCB structure while maintaining the sub-array configuration needed for high antenna gain.
Solution Approach 2:
The patent transitions from a planar two-dimensional PCB layer structure to a three-dimensional spatial arrangement of antenna elements. By utilizing vertical spacing and air coupling in the third dimension, the patent achieves sub-array functionality without requiring multiple stacked PCB layers, thereby reducing manufacturing complexity and cost.
3Reliability
If transmission lines are used to connect antenna elements, then signal can be transmitted, but production cost increases due to complex arrangement
Solution Approach 1:
The patent removes transmission lines from the antenna structure, extracting the component that creates arrangement complexity. The antenna elements are directly coupled through electromagnetic fields in air space, eliminating the need for complex transmission line routing and reducing overall device complexity while maintaining signal transmission capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air coupling sub-array structure enhances signal transmission efficiency and reduces manufacturing costs while allowing for more antenna elements to be mounted, thereby increasing overall antenna gain.
Implementation Method 1
a first printed circuit board (PCB) including a feeding line, a first radiator, a plurality of second radiators, a second PCB, and a frame structure are provided, wherein the frame structure is disposed to form an air layer between the first PCB and the second PCB
Data Source
AI summary
The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.