Air Duct Airtight Seal for PCB Cooling
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Solution Overview
Problem
High-power electronic systems face challenges in cooling due to increased heat generation from powerful processors, leading to thermal resistance issues that impede heat removal, resulting in reduced performance and reliability, with existing cooling techniques being costly and complex.
Innovation Solution
A cooling apparatus featuring a printed circuit board and an air duct forming an airtight channel using conformal foam to direct high-pressure air from system fans to heat sinks, minimizing air leakage and enhancing thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional ventilation holes or slots are used, then system cost and complexity are reduced, but cooling efficiency deteriorates due to air leakage and thermal resistance
Solution Approach 1:
The patent employs a flexible air duct made of compliant material that can be formed into complex three-dimensional shapes to conform to the contours of electronic components. This flexible duct creates an airtight seal against the components while maintaining ease of installation, resolving the contradiction between manufacturing simplicity and cooling efficiency by eliminating air leakage paths without requiring complex rigid structures
Solution Approach 2:
The air duct acts as an intermediary element between the fan and heat sink, creating a dedicated air-guiding channel that forces air through the heat sink fins rather than allowing it to bypass them. This intermediary structure ensures effective heat transfer while maintaining system simplicity
2Temperature
If motorized fans are installed in processing system cabinets, then heat removal capability is improved, but system cost and complexity increase disproportionately
Solution Approach 1:
The air duct is designed to be self-forming through a blow-molding process where air pressure from the fan itself forms the duct shape as air is forced through the molten material. This self-service formation method eliminates the need for complex external molding equipment or assembly steps, maintaining low system complexity while enabling effective heat removal through proper air guidance
Solution Approach 2:
The air duct is extracted as a separate, removable component that can be independently installed between the fan and heat sink. This extraction allows the duct to be optimized for airflow performance without being integrated into the complex cabinet structure, thereby improving heat removal capability while keeping system complexity low
3Temperature
If fan-type assemblies are mounted on or near heat-dissipating components, then cooling performance is improved, but device complexity and cost increase
Solution Approach 1:
The cooling system is segmented into distinct functional components: the fan, the air duct, and the heat sink. The air duct is designed as a separate component that can be independently optimized for airflow characteristics. This segmentation allows each component to be designed and manufactured separately, reducing overall device complexity while maintaining effective cooling performance through proper air guidance to the heat sink fins
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces air leakage, improves cooling efficiency, and maintains airtight seals despite varying component geometries, enhancing fan performance and reducing system complexity and cost.
Implementation Method 1
The air-guiding channel is bounded on one side by the printed circuit board and on remaining sides by the air duct that compresses against the printed circuit board in a substantially airtight seal
Data Source
AI summary
A cooling apparatus comprises a printed circuit board and an air duct positioned adjacent the printed circuit board spanning space and forming an air-guiding channel from at least one system fan to at least one heat sink. The air-guiding channel is bounded on one side by the printed circuit board and on remaining sides by the air duct that compresses against the printed circuit board in a substantially airtight seal.