Air Duct Structure for Direct Processor Cooling and Support
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Solution Overview
Problem
Computing devices face challenges in efficiently transferring heat away from processing components due to recirculation of air and physical impediments, which degrade performance and can lead to gravity-induced deflection of components.
Innovation Solution
The implementation of an air duct structure with defined channels and support surfaces to facilitate direct airflow and prevent recirculation, while providing structural support to processing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ventilation openings are provided for air flow, then heat transfer is improved, but air recirculation occurs which reduces cooling efficiency
Solution Approach 1:
The ventilation system is segmented into distinct inlet and outlet openings positioned at different locations. Inlet openings are provided at a first location to allow cool air entry, while outlet openings are provided at a second location to expel hot air. This spatial segmentation prevents recirculation by ensuring air enters and exits at separate points, thereby maintaining cooling efficiency while improving heat transfer.
2Adaptability or versatility
If processing components are mounted in the enclosure, then computing functionality is improved, but gravity-induced deflection occurs which affects component stability
Solution Approach 1:
A support structure is provided that counteracts the gravitational force acting on the processing component. The support structure includes a support surface that contacts the component and a counterweight mechanism that provides an opposing force to balance the component's weight. This prevents gravity-induced deflection and maintains component stability while allowing the component to be mounted in the enclosure for computing functionality.
3Temperature
If air flow channels are created, then cooling is improved, but physical impediments remain which block airflow paths
Solution Approach 1:
Physical impediments that block airflow paths are removed or extracted from the enclosure. The support structure is designed to minimize obstruction to air flow, and ventilation openings are strategically positioned to create clear airflow channels. By taking out blocking elements and optimizing the arrangement of openings and channels, the system achieves improved cooling performance with reduced airflow resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by reducing air recirculation and preventing component deflection, thereby improving the thermal management of computing devices.
Implementation Method 1
The air duct structure can include a plurality of side walls, the plurality of side walls defining a channel between the air inlet opening and the air outlet opening
Implementation Method 2
physical impediments, which degrade performance and can lead to gravity-induced deflection of components
Implementation Method 3
features for transferring heat away from processing components of the computing devices, which in some cases can include fans for generating an air flow
Data Source
AI summary
The present disclosure provides an air duct structure to receive a processing component. The air duct structure includes an air inlet opening, an air outlet opening, a plurality of side walls, and a support surface. The air inlet opening is in direct fluid communication with an air inlet of the computer chassis. The air outlet opening is in direct fluid communication with an air inlet of a processing component. The plurality of side walls at least partially define a channel extending between the air inlet opening and the air outlet opening. The support surface receives the processing component on the air duct structure relative to the computer chassis. The processing component includes an air exhaust to diffuse air, and the plurality of side walls at least partially fluidly isolate the air inlet opening from an air diffused from the air exhaust.