Air-Fired Conductive Copper Patterns via Reducing Agent Dispersion
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Solution Overview
Problem
Conventional methods for forming electroconductive patterned copper layers require a costly inert gas environment for thermal treatment, leading to increased production burdens and poor electric conductivity when treated in atmospheric conditions due to oxidation reactions.
Innovation Solution
A method involving a reducing agent-containing copper-based particle dispersion solution is printed or filled onto a substrate, where copper-based particles are mixed with a reducing agent and solvent, allowing firing in air to reduce copper oxide into copper, maintaining excellent electric conductivity without the need for an inert gas environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper-based particle patterned layer is fired in inert gas environment, then electric conductivity is improved, but device complexity and production cost increase
Solution Approach 1:
The patent converts the harmful oxidation reaction that would normally occur during atmospheric firing into a beneficial process by using a reducing agent. The reducing agent prevents copper oxide formation and promotes copper particle connectivity, turning what would be a harmful oxidation environment into a beneficial reducing environment without requiring inert gas infrastructure.
Solution Approach 2:
The reducing agent acts as an intermediary substance between the copper-based particles and the atmospheric oxygen. Instead of directly exposing copper particles to oxygen for firing, the reducing agent mediates the thermal treatment process, preventing oxidation and enabling atmospheric firing while maintaining electrical conductivity.
2Ease of manufacture
If copper-based particle patterned layer is fired in atmospheric circumstance, then production cost is reduced, but electric conductivity deteriorates due to oxidation
Solution Approach 1:
The patent converts the harmful oxidation reaction that would normally occur during atmospheric firing into a beneficial process by using a reducing agent. The reducing agent prevents copper oxide formation and promotes copper particle connectivity, turning what would be a harmful oxidation environment into a beneficial reducing environment without requiring inert gas infrastructure.
Solution Approach 2:
The patent changes the chemical environment parameter during firing by introducing a reducing agent into the copper-based particle dispersion solution. This parameter change transforms the chemical atmosphere from oxidizing to reducing, enabling atmospheric firing while preventing copper oxidation and maintaining electrical conductivity.
3Ease of manufacture
If reducing agent is added to copper-based particle dispersion solution, then atmospheric firing is enabled, but manufacturing complexity increases
Solution Approach 1:
The reducing agent is incorporated into the copper-based particle dispersion solution during the preparation stage, before the firing process. This preliminary action ensures that the reducing agent is already in place to prevent oxidation during atmospheric firing, eliminating the need for complex inert gas supply systems while adding only a simple mixing step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of patterned copper layers with excellent electric conductivity, reducing production costs and eliminating the need for inert gas supply systems, while maintaining high conductivity even when fired in air.
Implementation Method 1
copper-based particles are mixed with a reducing agent and solvent, allowing firing in air to reduce copper oxide into copper
Implementation Method 2
firing the reducing agent-containing copper-based particle patterned layer in the air
Data Source
AI summary
A method for preparing an electroconductive patterned copper layer, comprising mixing copper-based particles with a reducing agent, and then adding a solvent thereto to prepare a reducing agent-containing copper-based particle dispersion solution; printing on or filling in the reducing agent-containing copper-based particle dispersion solution a substrate in a predetermined shape to form a reducing agent-containing copper-based particle patterned layer; and firing the reducing agent-containing copper-based particle patterned layer in the air, which allows forming a patterned copper layer with excellent electric conductivity even in the air, thereby being industrially very useful.


