Air Flow Guide Duct for Substrate Treatment

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Solution Overview

Problem

The existing substrate treating apparatuses face issues with air flow stagnation and vortex formation when treating rotating substrates, leading to non-uniform film thickness and contamination due to backflow of fumes during the photolithography process.

Innovation Solution

The apparatus incorporates an air flow guide duct that introduces air flow in a tangential direction to the rotating substrate, guiding it to an outer side and connecting it to an integrated exhaust pipe, ensuring smooth air flow evacuation and preventing re-contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the substrate rotates at high speed to improve treatment efficiency, then productivity increases, but air flow stagnation and vortex formation worsen

Engineering Contradiction:

Improvesubstrate treatment efficiencyVSAvoidair flow evacuation smoothness

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The exhaust system is segmented into multiple exhaust ports distributed around the processing chamber, rather than a single central exhaust. This segmentation allows air flow to be evacuated from multiple locations simultaneously, preventing vortex formation and stagnation even at high substrate rotation speeds, thus maintaining both productivity and reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A specially designed air flow guide structure acts as an intermediary between the rotating substrate and the exhaust system. This guide structure channels air flow smoothly from the substrate surface to the exhaust ports, preventing direct collision and vortex formation, thereby enabling high-speed rotation without compromising air flow evacuation

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If the air flow collides with the outer cup to be exhausted, then the exhaust path is simplified, but vortex generation and air flow stagnation occur

Engineering Contradiction:

Improveexhaust path complexityVSAvoidfilm thickness uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The exhaust system utilizes the vertical dimension by positioning exhaust ports at different heights and angles relative to the substrate plane. Air flow is evacuated in multiple spatial dimensions rather than forcing horizontal collision with the outer cup, eliminating vortex formation while maintaining exhaust effectiveness without increasing device complexity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Instead of exhausting air flow by directing it toward the outer cup wall (outward radial direction), the exhaust ports are positioned to capture air flow moving inward toward the chamber center. This inverted approach prevents the air flow from colliding with the outer cup, eliminating vortex formation while maintaining simplified exhaust path design

Inventive Principle:

Principle #13The other way round (Inversion)

3Reliability

If the vortex forms at the collision point, then air flow evacuation is hindered, but contaminants can flow back to contaminate the substrate

Engineering Contradiction:

Improveair flow evacuation efficiencyVSAvoidsubstrate contamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The air flow guide structure preliminarily directs air flow along controlled paths before it reaches the exhaust ports, preventing the formation of vortices that would cause backflow. By preemptively managing air flow direction, the system prevents contamination before it can occur, maintaining both evacuation efficiency and substrate cleanliness

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The exhaust system design incorporates feedback principles by positioning exhaust ports to respond to the natural air flow patterns generated during substrate rotation. The multiple exhaust ports are strategically located to capture air flow at optimal points, ensuring continuous evacuation without creating stagnation zones where contaminants could accumulate and回流 to the substrate

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables uniform liquid film formation across the substrate and prevents contaminants from re-adsorbing, enhancing the efficiency of the substrate treatment process by improving air flow evacuation and reducing contamination.

Implementation Method 1

an air flow 84 on the surface of the substrate W flows from the center of the substrate W toward the edge thereof along the rotating direction of the substrate W by the centrifugal force

Methodology Applied

Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS11656557B2Apparatus for treating substrate

Publication Date: 2023.05.23 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

An apparatus for treating a substrate includes a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow in the inner space, wherein the exhaust unit includes an air flow guide duct guiding a flow direction of an air flow flowing on the substrate to an outer side of the substrate due to a rotation of the substrate supported by the support unit, and the air flow guide duct having an inlet into which an air flow is introduced, the inlet provided at a substantially same level with the substrate supported by the support unit.