Air Flow Redistribution Member for Semiconductor Baking Stability
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Solution Overview
Problem
In semiconductor fabrication, unstable air flow during the soft baking process leads to turbulence and temperature drops, causing solvent condensation and particle contamination, which deteriorate device performance.
Innovation Solution
An air flow redistribution member with multiple plates is introduced between the hot plate and exhaust member to stabilize the air flow, and a heating member is used to maintain the air flow temperature above the solvent's condensation point, ensuring efficient solvent exhaustion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional exhaust system is used during baking operation, then solvent exhaustion is achieved, but air flow instability causes turbulence and temperature drops leading to particle contamination
Solution Approach 1:
An air flow redistribution member is introduced as an intermediary component between the exhaust system and the baking chamber. This member redistributes the exhaust air flow to eliminate turbulence and stabilize temperature, preventing solvent condensation and particle contamination while maintaining effective solvent exhaustion.
Solution Approach 2:
The patent modifies the air flow parameters (velocity distribution, temperature uniformity) by introducing the air flow redistribution member. This changes the physical state of the air flow from turbulent and temperature-variable to stable and uniform, preventing the harmful condensation effect.
2Object-affected harmful factors
If heating member is added to maintain air flow temperature, then solvent condensation is prevented, but device complexity increases
Solution Approach 1:
The air flow redistribution member serves as a passive intermediary that utilizes the existing thermal energy in the exhaust air flow. By redistributing this heat rather than adding new heating components, the system prevents solvent condensation without significantly increasing device complexity.
Solution Approach 2:
The exhaust air flow itself provides the heating function through its thermal energy. The air flow redistribution member enables this self-heating effect by optimizing the distribution of thermal energy throughout the chamber, eliminating the need for additional active heating components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves air flow stability, reduces turbulence, and prevents solvent condensation, thereby minimizing particle contamination and enhancing the quality of fabricated semiconductor devices.
Implementation Method 1
a heating member is used to maintain the air flow temperature above the solvent's condensation point
Implementation Method 2
An air flow redistribution member with multiple plates is introduced between the hot plate and exhaust member to stabilize the air flow
Data Source
AI summary
The present disclosure provides an apparatus for fabricating a semiconductor structure, including an air flow redistribution member configured to receive an air flow at a first end and eject the air flow at a second end. The air flow redistribution member includes a first air flow redistribution plate and a second air flow redistribution plate between the first air flow redistribution plate and the second end.