Air Gap Coil Electronic Component Design
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Solution Overview
Problem
The existing methods for integrating coils with acoustic wave filters face challenges in maintaining high Q-values while minimizing size and simplifying fabrication, as coils surrounded by substrate insulating material deteriorate Q-values, and those placed in air gaps complicate fabrication and increase size.
Innovation Solution
The electronic component design features a first and second substrate with coil patterns facing each other across an air gap, with overlapping regions to enhance Q-values and reduce size, and includes a connection terminal to connect the coils, allowing for improved inductance and simplified fabrication by forming coils and wiring lines simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If coils are provided in substrate with insulating material surrounding them, then fabrication is simplified, but Q-value deteriorates
Solution Approach 1:
The patent extracts the coils from the substrate interior and places them on the substrate surface, allowing them to face each other across an air gap. This extraction removes the harmful surrounding insulating material while maintaining the simplified fabrication process of forming coils simultaneously with wiring lines.
Solution Approach 2:
The patent transitions from planar coils to three-dimensional facing coils across an air gap. By utilizing the vertical dimension and creating overlapping regions in plan view, the design achieves both high Q-value through air gap isolation and compact size through spatial overlap.
2Reliability
If coils are placed in air gaps spaced apart in longitudinal direction, then Q-value is improved, but device complexity and size increase
Solution Approach 1:
The patent merges the coil formation process with the wiring line formation process, allowing both to be created simultaneously in the same fabrication steps. This combination maintains the Q-value benefits of air-gap placement while eliminating the additional fabrication complexity that would result from separate coil assembly.
3Reliability
If coils are placed in air gaps spaced apart in longitudinal direction, then Q-value is improved, but device size increases
Solution Approach 1:
The patent implements nesting by having the second coil pattern located within the projection area of the first coil pattern in plan view. The overlapping regions allow the coils to be nested in the vertical dimension while facing each other across the air gap, achieving compact device size without compromising the Q-value benefits of air-gap placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the Q-value of the coils, reduces the size of the electronic component, and simplifies the fabrication process by allowing coils to be located across air gaps while overlapping, thereby increasing inductance and reducing resistance.
Implementation Method 1
a first coil pattern that is located on the first surface so as to face the second surface across an air gap; a second coil pattern that is located in a second region on the second surface and faces the first surface across the air gap
Data Source
AI summary
An electronic component includes: a first substrate having a first surface; a second substrate having a second surface facing the first surface across an air gap; a first coil pattern that is located on the first surface so as to face the second surface across the air gap; a second coil pattern that is located in a second region on the second surface and faces the first surface across the air gap, at least a part of the second region overlapping with a first region in plan view, the first region being formed of a region in which the first coil pattern is located and a region surrounded by the first coil pattern; and a connection terminal connecting the first coil pattern and the second coil pattern.