Air Guide Covers for Uniform Chip Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods in servers result in nonuniform heat dissipation between chips, leading to uneven service life due to decreased cooling intensity as airflow passes through multiple chips.
Innovation Solution
A heat dissipation system and method that utilizes air guide covers to direct airflow, ensuring that the first airflow dissipates heat from the first chip while the second airflow, which bypasses the first chip's heat sink, is used to dissipate heat from the second chip, maintaining similar initial temperatures and uniform heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple chips are arranged in sequence along the airflow direction for heat dissipation, then the server can perform heat dissipation on multiple chips, but the cooling intensity decreases significantly for chips at the rear end, resulting in nonuniform heat dissipation
Solution Approach 1:
The patent divides the airflow into multiple independent paths by introducing air guide covers. Each chip or group of chips is assigned a dedicated airflow path, segmenting the overall heat dissipation process into parallel operations rather than sequential processing. This ensures that each chip receives sufficient cooling intensity regardless of its position in the sequence.
Solution Approach 2:
The patent introduces a spatial dimension to airflow management by positioning air guide covers at specific locations (front and rear sides of chips) to create multiple three-dimensional airflow paths. This dimensional approach allows air to flow through different routes simultaneously, bypassing the sequential limitation and achieving uniform heat dissipation across all chips.
2Productivity
If the airflow flows through chips in sequence, then heat dissipation can be performed on all chips, but the temperature of the airflow rises continuously, reducing cooling efficiency for rear chips
Solution Approach 1:
The airflow is segmented into multiple independent streams using air guide covers. Each stream serves a specific chip or group of chips, preventing the cumulative temperature rise that occurs in sequential flow. This segmentation ensures that each airflow path maintains a lower, more effective temperature for heat dissipation.
Solution Approach 2:
The air guide covers act as intermediary structures that redirect and separate airflow paths. These intermediaries ensure that hot air from one chip does not mix with the incoming cool air for the next chip, maintaining optimal temperature differences for heat dissipation efficiency throughout the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures relatively uniform heat dissipation between chips, extending the service life of both the front and rear chips by optimizing airflow direction and heat sink utilization, thereby maintaining consistent performance across all chips in the server.
Implementation Method 1
the airflow firstly flows through a heat sink of the chip at a front end, and takes away heat of the heat sink
Data Source
AI summary
A heat dissipation system includes a motherboard, at least two chips, at least two heat sinks and at least two air guide covers. Every two chips of the at least two chips constitute a chipset, the chips in each chipset are installed on the motherboard in sequence along an airflow direction, each of the at least heat sinks is installed on a surface of the chip corresponding to the heat sink, and every two air guide covers of the at least two air guide covers constitute an air guide group. In the air guide group, a first air guide cover is arranged on a first side of a first chip, and a second air guide cover is arranged on a second side of a second chip. A heat dissipation method based on the system is also provided. The solution ensures a relatively uniform heat dissipation between the chips.