Air Guide With Heat Pipe and Sink for Cooling
Solution Overview
Problem
Existing electronic apparatuses face inefficiencies in heat dissipation due to turbulent airflow and high air resistance in heat sinks, which reduces the effectiveness of cooling systems despite increased surface area and thermal conductivity materials.
Innovation Solution
An air guide with strategically positioned heat pipes and heat sinks is used to guide heat from a heat source to the heat sinks, increasing airflow and heat dissipation efficiency by optimizing airflow direction and heat sink distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the surface area of the heat sink is increased by making fins thinner and increasing the number of fins, then the heat dissipation efficiency is improved, but the air resistance of the heat sink increases
Solution Approach 1:
The patent introduces a guide vane as an intermediary component between the fan and the heat sink. The guide vane redirects and smooths the airflow before it reaches the heat sink, reducing turbulence and air resistance. This allows the heat sink to maintain its high surface area design for effective heat dissipation while the guide vane mitigates the negative effect of increased air resistance.
2Temperature
If the rotation speed of the fan is increased to increase airflow, then the heat dissipation efficiency is improved, but the power consumption increases
Solution Approach 1:
The patent segments the airflow control function by introducing a guide vane that works in conjunction with the fan. Instead of relying solely on increasing fan speed to improve airflow, the guide vane is added as a separate component that optimizes airflow direction and reduces resistance. This segmentation allows the system to achieve better heat dissipation with lower fan speed, thereby reducing power consumption.
3Temperature
If a fan is disposed on an air inlet or air outlet to blow air into or suck air out of the electronic apparatus, then cooling is provided, but turbulent flows occur and air exchange efficiency is lowered
Solution Approach 1:
The guide vane performs a preliminary action by pre-conditioning the airflow before it reaches the heat sink. It straightens and directs the airflow in advance, eliminating turbulence that would otherwise occur at the heat sink inlet. This preliminary airflow optimization ensures efficient air exchange and maximizes the cooling effect without requiring higher fan speeds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency by ensuring more air flows through the heat sinks, effectively reducing electronic component temperatures and improving durability.
Implementation Method 1
The heat pipe is disposed on the surface of the cover, and each of the heat pipes has a first end and a second end. The first end of the heat pipe is close to the heat source, and the second end is close to one of the heat sinks, such that the heat generated by the heat source can be guided by the heat pipe to the heat sink.
Implementation Method 2
The heat sink is disposed on the surface of the cover and is as distant as possible from the heat source. The distribution of the heat sinks of the air guide can enable more blown-in air to flow through heat sinks.
Data Source
AI summary
The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.