Air Jet Embedded Chassis Cooling Design
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Solution Overview
Problem
Traditional server chassis designs face limitations in air flow quantity and cooling efficiency due to barriers near fans, which restrict the operating velocity and power of electronic components, necessitating a solution to enhance air flow and thermal management.
Innovation Solution
The integration of high static pressure fans and an air jet structure within the chassis, utilizing side air ducts and nozzle frames to increase air velocity and volume, thereby enhancing cooling efficiency by directing high-pressure air jets towards electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fan velocity is increased to increase air flow, then cooling efficiency is improved, but vortices near fan inlet increase and fan efficiency decreases
Solution Approach 1:
Air ducts are positioned to guide air flow from storage devices toward the fan inlet before the fan operates, creating a pre-conditioned flow path that reduces turbulence and vortices at the fan inlet, thereby maintaining fan efficiency while achieving increased air flow quantity
Solution Approach 2:
Air ducts serve as intermediary structures between storage devices and fans, channeling and organizing air flow in a controlled manner to prevent direct interaction between obstructive components and fan inlet, thus reducing vortex formation and energy loss
2Productivity
If components are removed to reduce air impedance, then air flow is improved, but device capabilities are reduced
Solution Approach 1:
The chassis is segmented into distinct zones with dedicated air ducts for different component types, allowing air flow optimization for each zone independently while maintaining all necessary components, thus improving air flow without reducing device capabilities
Solution Approach 2:
Air ducts are positioned in three-dimensional space above and between components rather than removing components, utilizing vertical and lateral dimensions to create air flow channels that pass through and around components, maintaining full device capability while achieving improved air flow
3Speed
If fan speed is increased to increase cooling, then air flow velocity is improved, but vortices near fan inlet increase and cooling efficiency decreases
Solution Approach 1:
Air ducts pre-organize and streamline air flow before it reaches the fan inlet, creating a more uniform and controlled flow pattern that allows the fan to operate at higher speeds without generating excessive vortices, thereby maintaining cooling efficiency while achieving higher air flow velocity
Solution Approach 2:
The air duct design changes the flow parameters (velocity distribution, turbulence intensity, flow direction) of air before it enters the fan, creating optimal inlet conditions that enable higher fan speeds to be achieved without the detrimental vortex effects, thus improving air flow velocity while maintaining cooling efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases air flow volume and cooling efficiency, allowing for higher operating velocities and power capacity of electronic components while minimizing thermal impedance and vortices, thus improving overall system performance.
Implementation Method 1
Airflow to vent away such heat is often generated by a fan system that accelerates airflow through the components and the heat sink
Implementation Method 2
Heat sinks are typically composed of thermally conductive material. Heat sinks absorb the heat from the electronic components, thus transferring the heat away from the components
Implementation Method 3
The generated airflow thus carries collected heat away from the components and the heat sink
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end of the chassis. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.