Air Layer Thermal Insulation for Heat Dissipating Devices
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Solution Overview
Problem
The challenge of effectively dissipating heat from heat-generating components in electronic devices while isolating these components from heat-sensitive elements, such as battery cells, to prevent overheating and maintain device performance.
Innovation Solution
The implementation of an air layer between heat-generating units, such as ICs, and heat-sensitive objects, like battery cells, utilizing air convection and insulation to dissipate heat away from sensitive elements, thereby preventing heat conduction and maintaining device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-sensitive elements are isolated from heat sources using traditional thermal insulation materials, then thermal insulation performance is improved, but device volume increases and design space is reduced
Solution Approach 1:
The patent utilizes air as a thermal insulation medium between the heat source and heat-sensitive elements. By creating an air gap or air cavity in the device structure, the patent leverages the low thermal conductivity of air to provide thermal insulation without adding solid insulation materials, thereby maintaining compact device volume while achieving effective heat isolation.
Solution Approach 2:
The patent introduces air as an intermediary substance between the heat source and heat-sensitive elements. This air layer acts as a thermal barrier that mediates the heat transfer process, preventing direct thermal conduction from the heat source to sensitive components while maintaining a compact overall device structure.
2Reliability
If heat is isolated from heat-sensitive elements, then reliability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent segments the device into distinct thermal zones: a heat source region, an air gap insulation layer, and a heat-sensitive element region. This segmentation allows heat to be managed differently in each zone - concentrated at the source, isolated in the middle, and protected at the sensitive end - thereby achieving both protection and dissipation.
Solution Approach 2:
The patent uses air convection within the air gap to facilitate heat dissipation. The air layer serves dual purposes: it provides thermal insulation through low conductivity while simultaneously enabling convective heat transfer away from the heat source, thus maintaining reliability without compromising heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively isolates heat sources from heat-sensitive elements, enhancing thermal insulation and preventing overheating, thus ensuring the functional performance and longevity of electronic devices.
Implementation Method 1
an air layer, which is arranged in between the heat generating unit and the heat sensitive object. The heat generated by the heat generating unit is isolated by the air layer.
Implementation Method 2
utilizing air convection to dissipate part of heated air which is close to the source
Implementation Method 3
By applying an air layer (the term air layer may be interchangeable with other terms such as air barrier, air flow or air wall) to insulate heat conduction and utilizing air convection to dissipate part of heated air which is close to the source, so that to achieve thermal insulation for heat-sensitive element. When a product embodying the present invention is placed upright, the air layer can also be used as a convection and dissipation layer. According to chimney effect, cold air will enter from the vent below the air layer, that further takes away the heat generated from the heat source and dissipates it through the upper vents
Data Source
AI summary
The invention provides a heat dissipating device comprising: a heat generating unit, which generates heat when under operation and is placed at a first side of the heat dissipating device; a heat sensitive object, which is placed at a second side of the heat dissipating device; and an air layer, which is arranged in between the heat generating unit and the heat sensitive object. The heat generated by the heat generating unit is isolated by the air layer.