Air-Pin Chip Ejector for Low-Stress Thin Chip Detachment
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Solution Overview
Problem
Thin chips (horizontal and vertical width of 10 mm, thickness of 30 μm or less) are prone to cracking or breaking when pushed up by sharp pins during the die bonding process in semiconductor manufacturing due to the high stress applied by conventional methods.
Innovation Solution
A chip ejector with a holder having vertical holes and a pressurization unit that uses air pins to provide pressurized air to the mount tape, combined with a vacuum unit to selectively raise and detach the chip from the tape, minimizing stress and preventing cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a sharp pin is used to push up thin chips during die bonding, then the chip can be detached from the mount tape, but the chip may crack or break due to high stress
Solution Approach 1:
The patent replaces the mechanical sharp pin pushing system with a pneumatic system using air pins that deliver pressurized air through holes in the holder to push the mount tape and detach chips without direct mechanical contact, eliminating stress concentration and chip damage
Solution Approach 2:
The patent uses air pins connected to a pressurized air source that deliver controlled pneumatic pressure through vertical holes in the holder to the mount tape, enabling stress-free chip detachment and positioning without mechanical contact
2Strength
If pressurized air is applied to detach the chip, then chip damage is prevented, but additional components (air pins, holes, pressurization unit) are required
Solution Approach 1:
The holder is designed with multiple functions: it supports the mount tape, provides structural stability, and contains integrated holes that guide pressurized air from the air pins to the tape, combining support and pneumatic delivery functions in a single component
Solution Approach 2:
The air pins are inserted into the holes of the holder, with the pressurized air flow path nested within the holder structure, creating a compact integrated system where components are nested within each other to minimize overall complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively detaches thin chips from the mount tape with minimal stress, preventing cracks and ensuring smooth transfer without tilting or rotation, thereby enhancing the reliability of the chip handling process.
Implementation Method 1
a pressurization unit providing pressurized air to a mount tape that is disposed on the holder
Implementation Method 2
a vacuum unit configured to provide vacuum pressure to the lower surface of the mount tape
Data Source
AI summary
The chip ejector includes a chamber including an inner space, a holder disposed on the chamber, and having an upper surface and a lower surface opposite to the upper surface, a plurality of holes formed in the holder along a vertical direction, which is perpendicular to the first direction and the second direction and spaced apart from each other in the first direction, and the second direction and a pressurization unit providing pressurized air to a mount tape that is disposed on the holder. The pressurization unit includes at least one air pin inserted into at least one hole among the plurality of holes along the vertical direction and having a discharge hole extending along the vertical direction and an air inlet pipe fastened to the air pin and comprising at least one path through which a pressurized air flow is provided to the air pin.