Semiconductor Die Singulation Using Air Pressure Along Scribe Lines
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor die singulation processes using mechanical blades risk chipping or cracking the dies due to blade shaking, and reducing cutting speed to mitigate this issue decreases production efficiency and blade lifespan.
Innovation Solution
A non-contact semiconductor die singulation process using compressed air to form a groove or channel on a semiconductor wafer along scribe lines, applying pressure to deform the wafer and separate the dies without direct contact, leveraging the elastic properties of dicing tape to minimize cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If cutting speed is reduced to reduce blade shaking and chipping, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The patent replaces the mechanical blade cutting system with a non-contact laser-based system. The laser forms a groove or channel along the scribe line without physical contact, eliminating blade shaking and mechanical stress on the fragile semiconductor dies. This substitution maintains high cutting speed while preventing chipping and cracking, thus resolving the contradiction between manufacturing precision and productivity.
Solution Approach 2:
The patent uses compressed air to blow along the laser-formed groove to facilitate die separation. The pneumatic flow removes debris and applies controlled pressure to propagate the crack along the scribe line, enabling clean separation without mechanical contact. This pneumatic assistance maintains high throughput while ensuring die integrity.
2Manufacturing precision
If cutting speed is reduced to reduce blade shaking, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces the mechanical blade with a laser system, eliminating blade wear and the associated complexity of blade replacement and maintenance. The laser system has no consumable cutting elements that degrade, significantly reducing device complexity related to blade life management while maintaining or improving die integrity.
3Productivity
If mechanical blade cutting is used to maintain high productivity, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent replaces mechanical blade cutting with laser-based non-contact cutting. The laser forms a precise groove along the scribe line without physical contact, eliminating blade shaking and mechanical stress that cause chipping. This substitution maintains high cutting speed for productivity while dramatically improving die integrity through contactless processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the size and occurrence of chips or cracks in semiconductor dies, increases production efficiency by maintaining throughput, and extends blade life compared to conventional methods.
Implementation Method 1
compressed air is applied along the groove or the channel. Pressure from the compressed air causes the semiconductor wafer to deform
Implementation Method 2
Pressure from the compressed air causes the semiconductor wafer to deform (e.g., deform downward from the exposed surface). As the semiconductor wafer deforms, the semiconductor wafer is split along the channel
Data Source
AI summary
A non-contact semiconductor die singulation process utilizes compressed air to separate a first portion of a semiconductor wafer from a second portion of the semiconductor wafer. During the non-contact semiconductor die singulation process, the semiconductor wafer is placed on dicing tape. A channel is formed along various scribe lines in the semiconductor wafer. When the channels are formed, a compressed air tool applies compressed air along a length of the channel. Pressure from the compressed air causes the semiconductor wafer to deform. As the semiconductor wafer deforms, the semiconductor wafer cracks or splits along the length of the scribe line thereby separating the first portion of the semiconductor wafer from the second portion.