Aircraft Floor Heating Circuit With Low-Resistivity Conductive Ink
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Solution Overview
Problem
Traditional chemically etched alloy resistive heating elements for heated floor panels are time-consuming, prone to manufacturing difficulties, and mechanical fatigue, while resin-based conductive ink circuits face challenges in achieving low resistivity without compromising mechanical strength.
Innovation Solution
A method involving depositing silver particles in epoxy resin on a dielectric film, followed by heat curing at specific temperatures to achieve a resistivity of less than 1.68×10−6 ohm·meter, with silver loading between 65%-95% and post-curing at temperatures between 155° C.-200° C., allowing for patterned layers and improved mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemically etched alloy elements are used for heating elements, then satisfactory heating performance is achieved, but the manufacturing process is time-consuming and prone to defects
Solution Approach 1:
The patent replaces the chemical etching process with a screen printing process using conductive ink. Instead of chemically removing material to create heating traces, the invention deposits a conductive ink formulation containing metal particles (silver, aluminum, or copper) in a polymer matrix onto the floor panel surface, then cures it to form the heating element. This substitution eliminates the complex multi-step chemical etching process while achieving comparable or superior electrical conductivity and mechanical properties.
Solution Approach 2:
The patent changes the fundamental parameter of how conductivity is achieved: rather than creating conductive paths through chemical removal of non-conductive material, the invention directly deposits conductive material in the desired pattern. The conductive ink formulation allows control of electrical resistance through particle concentration, size, and distribution, enabling precise tuning of heating characteristics without chemical processing.
2Reliability
If chemically etched alloy elements are used for heating elements, then heating function is achieved, but mechanical fatigue and manufacturing defects occur
Solution Approach 1:
The patent replaces the chemical etching process with a screen printing process using conductive ink. Instead of chemically removing material to create heating traces, the invention deposits a conductive ink formulation containing metal particles (silver, aluminum, or copper) in a polymer matrix onto the floor panel surface, then cures it to form the heating element. This substitution eliminates the complex multi-step chemical etching process while achieving comparable or superior electrical conductivity and mechanical properties.
Solution Approach 2:
The conductive heating element is formed as a composite material consisting of metal particles (silver, aluminum, or copper) dispersed in a polymer matrix resin. This composite structure provides both electrical conductivity through the metal particle network and mechanical flexibility and adhesion through the polymer binder, eliminating the brittleness and fatigue issues associated with chemically etched alloy elements.
3Ease of manufacture
If resin-based conductive ink circuits are used, then ease of manufacture and mechanical strength are improved, but achieving low resistivity becomes challenging
Solution Approach 1:
The patent changes the fundamental parameter of how conductivity is achieved: rather than creating conductive paths through chemical removal of non-conductive material, the invention directly deposits conductive material in the desired pattern. The conductive ink formulation allows control of electrical resistance through particle concentration, size, and distribution, enabling precise tuning of heating characteristics without chemical processing.
Solution Approach 2:
The patent applies local quality by varying the concentration, size, and distribution of metal particles within the conductive ink formulation in different regions or layers to achieve desired resistance values. The screen printing process allows precise control of material deposition thickness and distribution, enabling local adjustment of electrical properties to meet specific heating requirements for different floor panel zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a heating element with reduced rework, scrap, and defects, improved mechanical strength, and lower labor and chemical disposal costs, while maintaining low resistivity, suitable for aircraft applications.
Implementation Method 1
resistive heating elements of heated floor panels
Implementation Method 2
temperature heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×10−6 ohm·meter
Data Source
AI summary
A method of forming a heating element includes depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit, and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×10−6 ohm·meter. An aircraft heated floor panel includes at least one floor panel of an aircraft includes a conductive circuit positioned within the floor panel having a conductive ink of silver particles in an epoxy resin on a dielectric film.