Aircraft LED Light Unit Thermal Management
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Solution Overview
Problem
Aircraft interior LED lighting systems experience uneven aging and brightness due to temperature differences caused by the power supply, leading to non-uniform light output and shorter lifetimes.
Innovation Solution
The use of thermal transfer members of varying sizes, depending on the distance from the power source, to equalize operating temperatures and aging processes among LEDs, ensuring uniform light output and extended lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LEDs are mounted on a PCB with a centralized power supply, then the lighting system is cost-effective and has long lifetime, but temperature gradients cause uneven aging and non-uniform light output
Solution Approach 1:
The patent applies local quality by varying the thermal transfer member characteristics (size, material, geometry) at different locations on the PCB. Specifically, LEDs closer to the power supply are equipped with larger or more efficient thermal transfer members to compensate for the additional heat exposure, while LEDs farther away use smaller thermal transfer members. This localized differentiation ensures uniform operating temperatures and consistent light output across all LEDs throughout their operational lifetime.
2Ease of manufacture
If uniform thermal transfer members are used for all LEDs, then manufacturing is simplified, but LEDs at different distances from the power supply experience different temperatures and age differently
Solution Approach 1:
The patent implements local quality by making thermal transfer members location-dependent. The thermal transfer members are designed with varying dimensions, materials, or geometries based on their position relative to the power supply. For example, thermal transfer members near the power supply may be larger in area or made of materials with higher thermal conductivity to compensate for the heat radiated by the power supply, ensuring all LEDs reach similar operating temperatures and exhibit uniform aging characteristics.
3Stability of the object's composition
If larger thermal transfer members are used for LEDs closer to the power supply, then temperature uniformity is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies parameter changes by systematically varying key parameters of the thermal transfer members (such as surface area, thickness, material composition, or geometric shape) based on the LED's position on the PCB. This controlled parameter variation allows compensation for temperature gradients while maintaining a relatively simple overall structure. The changes are calculated and designed during the manufacturing process rather than requiring complex active control systems, thus achieving temperature uniformity without excessive device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces temperature gradients across the PCB, maintains consistent light output, and extends the operational life of the LED light units by ensuring all LEDs age similarly and can be jointly controlled, resulting in a more uniform and longer-lasting illumination.
Implementation Method 1
each one of the plurality of LEDs being associated with a respective thermal transfer member having a predetermined size, for transferring heat away from the respective LED
Data Source
Figure 1A~1B
Figure 2A~2C
AI summary
An interior aircraft LED light unit (10) includes at least one printed circuit board (1), on which a plurality of LEDs (2a, 2b, 2c, 2d, 2e) are connected to a power source (3), each one of the plurality of LEDs (2a, 2b, 2c, 2d, 2e) having a predetermined distance (Da, Db, Dc, Dd, De) to the power source (3), and each one of the plurality of LEDs (2a, 2b, 2c, 2d, 2e) being associated with a respective thermal transfer member (5a, 5b, 5c, 5d, 5e; 7a, 7b, 7c, 7d, 7e) having a predetermined size, for transferring heat away from the respective LED (2a, 2b, 2c, 2d, 2e), wherein, for at least some of the plurality of LEDs (2a, 2b, 2c, 2d, 2e) the predetermined size of the respective thermal transfer member (5a, 5b, 5c, 5d, 5e; 7a, 7b, 7c, 7d, 7e) varies with the predetermined distance (Da, Db, Dc, Dd, De) of the LED (2a, 2b, 2c, 2d, 2e) to the power source (3).