Aircraft LED Light Unit 3D Circuit Heat Dissipation
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Solution Overview
Problem
Aircraft LED light units have insufficient space efficiency due to the constraints of traditional printed circuit boards, limiting the arrangement and heat dissipation of LEDs, which affects illumination power and weight.
Innovation Solution
The design of a flat, three-dimensional electric circuit device with power supply circuitry and heat transport elements allows LEDs to be mounted on side surfaces, enabling efficient heat transfer and higher LED density, reducing volume and weight by about two-thirds and weight by 50% compared to previous designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If LEDs are mounted on a traditional printed circuit board, then the circuit board structure is simple and easy to manufacture, but the space efficiency is insufficient and heat dissipation is limited
Solution Approach 1:
The patent transitions from a two-dimensional printed circuit board layout to a three-dimensional circuit device structure. LEDs are mounted on the side surfaces of the circuit device, utilizing the third dimension (depth/thickness) for both component placement and heat dissipation pathways. This dimensional change enables higher LED density and improved thermal management without significantly increasing manufacturing complexity.
2Temperature
If LEDs are arranged on the side surfaces of the electric circuit device, then heat dissipation efficiency is improved and LED density is increased, but the circuit device structure becomes more complex
Solution Approach 1:
The patent merges the heat dissipation function with the structural body of the circuit device. The circuit device itself serves as both the electrical connection medium and the heat transport structure. Heat transport elements are integrated within the circuit device body, combining multiple functions (electrical conduction, thermal conduction, structural support) into a single integrated component, thereby reducing overall system complexity despite the advanced mounting configuration.
Solution Approach 2:
The circuit device is designed to perform multiple functions simultaneously: it provides electrical connections for LEDs, serves as a structural mounting platform for side-surface LED placement, acts as a heat transport pathway, and provides mechanical support. This multi-functionality reduces the need for separate components and simplifies the overall device architecture.
3Quantity of substance
If traditional printed circuit board constraints are applied, then manufacturing is easier, but LED density and illumination capacity are limited
Solution Approach 1:
By moving from 2D PCB mounting to 3D side-surface mounting, the patent充分利用 the available surface area of the circuit device. Multiple LEDs can be arranged in close proximity on vertical side surfaces, dramatically increasing LED density. The three-dimensional structure eliminates the need for complex layer routing and allows direct mounting without spatial constraints inherent in planar PCB design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves substantial space and weight reductions while maintaining high illumination capacity, allowing for more LEDs to be integrated in close proximity without the spatial constraints of printed circuit boards, enhancing aircraft lighting systems.
Implementation Method 1
The at least one LED is in heat exchange relationship with the at least one heat transport element... the waste heat can be transported away from the LED slug directly into the body of the electric circuit device via the heat transport element(s)
Data Source
AI summary
An aircraft LED light unit is disclosed that includes a flat electric circuit device having a first main surface, a second main surface and at least one side surface extending between the first main surface and the second main surface, power supply circuitry, disposed in the electric circuit device, at least one heat transport element, disposed in the electric circuit device, and at least one LED. The at least one LED is arranged on the at least one side surface of the electric circuit device, is electrically coupled to the power supply circuitry, and is in heat exchange relationship with the at least one heat transport element.