Aircraft Light Unit TEC Cooling for High-Temperature PCB Protection

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Solution Overview

Problem

Aircraft light units, particularly those mounted near the auxiliary power unit exhaust, experience performance degradation due to prolonged exposure to high temperatures, leading to premature failure and increased maintenance costs.

Innovation Solution

A thermoelectric cooler (TEC) is integrated with a heat sink and spacer to actively cool the circuit board assembly, using a temperature sensor and controller to manage the cooling process, preventing heat accumulation and maintaining the circuit board assembly below 120°C.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the light unit is mounted near the APU exhaust to meet positioning requirements, then the light unit can be installed in the required location, but the circuit board assembly is exposed to high temperatures causing performance degradation

Engineering Contradiction:

Improveinstallation location flexibilityVSAvoidcircuit board assembly performance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

A thermoelectric cooler (TEC) is introduced as an intermediary component between the circuit board assembly and the high-temperature environment. The TEC actively pumps heat away from the circuit board, serving as a thermal mediator that decouples the circuit board's operating temperature from the ambient temperature near the APU exhaust, thereby maintaining reliability while allowing installation in the required location

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces passive thermal management approaches with an active thermoelectric cooling system. The TEC uses electrical energy to create a temperature differential, substituting mechanical/thermal conduction-based cooling with an electrically-driven heat pump mechanism that can actively counteract the high-temperature environment

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If a cooling system is added to the light unit, then the circuit board assembly temperature is reduced, but the device complexity increases

Engineering Contradiction:

Improvecircuit board assembly temperatureVSAvoidcooling system structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The cooling system components (thermoelectric cooler, heat sink, spacer, and insulation material) are merged into a single integrated assembly that attaches to the circuit board. This consolidation reduces the number of separate parts and simplifies installation while achieving effective thermal management through the combined function of all components

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cooling system is designed to be self-regulating to the extent possible, where the thermoelectric cooler and heat sink work together passively once installed. The system serves itself by creating its own thermal management capability without requiring external control systems or additional active components beyond the TEC itself

Inventive Principle:

Principle #25Self-service

3Adaptability or versatility

If prolonged exposure to hot air occurs, then the light unit operates in the required environment, but the circuit board assembly experiences performance degradation and premature failure

Engineering Contradiction:

Improveenvironmental toleranceVSAvoidlight unit life span

Core Design Contradiction:

Adaptability or versatilityVSDuration of action of stationary object

Solution Approach 1:

The thermoelectric cooler applies preliminary cooling action to counteract the harmful thermal effects before they can cause performance degradation or failure. By continuously or periodically removing heat from the circuit board assembly, the system prevents the accumulation of thermal damage that would otherwise occur during prolonged exposure to hot air near the APU exhaust

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cooling system effectively reduces heat accumulation, prolongs the life span of the light unit, and prevents premature failure, reducing maintenance costs and downtime.

Implementation Method 1

a thermoelectric cooler coupled to the circuit board assembly and configured to dissipated heat from the circuit board assembly

Methodology Applied

Scientific EffectThermoelectric effect: Peltier Effect

Implementation Method 2

a heat sink disposed over the thermoelectric cooler and configured to dissipate heat from the thermoelectric cooler

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS12504147B2Lighting electronics cooling using high temp TEC with integrated heat sink

Publication Date: 2025.12.23 GOODRICH LIGHTING SYSTEMS INC

AI summary

An aircraft light unit is disclosed herein. The aircraft light unit includes a housing having a first side and an opposing second side, a light coupled to the first side of the housing, a circuit board assembly coupled to second side of the housing, a thermoelectric cooler coupled to the circuit board assembly and configured to dissipated heat from the circuit board assembly, and a heat sink disposed over the thermoelectric cooler and configured to dissipate heat from the thermoelectric cooler.