Aircraft Mounting Plate With Oscillating Heat Pipe Cooling
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Solution Overview
Problem
Existing electronic systems in aircraft, particularly active antenna systems, face challenges in efficiently dissipating large amounts of heat generated during operation, leading to potential damage and performance issues, and current cooling solutions may cause galvanic corrosion or inadequate isothermalization.
Innovation Solution
A mount system incorporating a thermally conductive plate element with an oscillating heat pipe and heat sinks, which directs airflow over heat sinks to dissipate heat efficiently, utilizing alternating liquid slugs and vapor plugs to transfer heat from the central region to edge regions for dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active antenna systems are mounted on the outside of the aircraft to expose them to airflow, then convection cooling is improved, but the heat generation from electronic components increases and requires additional cooling measures
Solution Approach 1:
The patent combines the mounting structure with thermal management functions by integrating heat sinks and thermally conductive materials directly into the mounting bracket that attaches the antenna to the aircraft surface. This merging of structural support and heat dissipation functions allows the same component to both mount the antenna and manage its thermal output.
Solution Approach 2:
The patent introduces thermal paste or other thermally conductive compounds as intermediary materials between the antenna's heat-generating components and the heat sinks in the mounting structure. This intermediary enhances heat transfer efficiency by filling micro-gaps and improving thermal contact between surfaces.
2Temperature
If different metal materials such as copper and aluminum are used in the mounting system, then thermal conductivity is improved, but galvanic corrosion occurs due to dissimilar metal contact
Solution Approach 1:
The patent employs mounting structures made from uniform metal materials (such as aluminum or copper) throughout, avoiding contact between dissimilar metals. This homogeneity eliminates galvanic corrosion risks while maintaining adequate thermal conductivity through the selected material properties.
Solution Approach 2:
The patent utilizes composite material approaches by combining metal mounting structures with polymer or ceramic thermal management components, or by applying protective coatings to metal surfaces. This allows achieving both thermal performance and corrosion resistance without relying on dissimilar metal contacts.
3Adaptability or versatility
If the mounting system is designed to accommodate varying aircraft surfaces, then adaptability is improved, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent incorporates adjustable and flexible mounting features such as adjustable brackets, flexible mounting plates, or mechanismsthat allow the mounting system to adapt to different aircraft surface geometries. These dynamic elements enable proper alignment and thermal contact without requiring extremely tight manufacturing tolerances across all components.
Solution Approach 2:
The patent divides the mounting system into multiple separable components (such as separate mounting brackets, positioning elements, and thermal interface components) that can be independently adjusted and assembled. This segmentation allows each component to be manufactured with standard tolerances while achieving precise overall alignment through assembly adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates significant heat generated by active electronics systems, preventing damage and ensuring optimal performance while avoiding galvanic corrosion, suitable for mounting on varying aircraft surfaces.
Implementation Method 1
A mount system incorporating a thermally conductive plate element with an oscillating heat pipe and heat sinks, which directs airflow over heat sinks to dissipate heat efficiently, utilizing alternating liquid slugs and vapor plugs to transfer heat from the central region to edge regions for dissipation.
Implementation Method 2
utilizing alternating liquid slugs and vapor plugs to transfer heat from the central region to edge regions for dissipation
Implementation Method 3
A mount system incorporating a thermally conductive plate element with an oscillating heat pipe and heat sinks
Implementation Method 4
which directs airflow over heat sinks to dissipate heat efficiently
Data Source
Figure 1~2
Figure 2A
Figure 3
AI summary
An electronics system (10) for an aircraft includes a mounting structure (12) and a generally planar plate element (40) mounted to the mounting structure (12) which has opposing face surfaces (41, 43) and includes a central region (50) and side edge regions (52). A serpentine passage (100) is formed in the plate element (40) between the face surfaces and contains alternating liquid slugs and vapor plugs along its length. The plate element 40 is configured for gathering heat proximate the central region (50) and moving the heat to the side edge regions (52) through interaction with the liquid slugs and vapor plugs of the serpentine passage. An electronic system (30, 32) is mounted on a face surface of the plate element proximate the central region (50). A heat dissipating structure, such as a heat sink or an integral portion (120) of the mounting structure (12) is thermally coupled with the plate element and positioned along the side edge regions thereof for dissipating heat of the electronic system (30, 32) moved to the side edge regions (50). A cover structure (14) covers the plate element and electronic system. In one version, the cover (14) has apertures (16, 18) in ends thereof positioned for directing air over the heat sinks.