Aircraft Power Switch Busbar Assembly for Heat Dissipation

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Solution Overview

Problem

Modern aircraft solid state power controllers face challenges in efficiently dissipating heat from solid state power switches, which can lead to overheating during operation.

Innovation Solution

A solid state power switch assembly comprising a circuit board, solid state power switches, and a busbar that sandwiches the switches between the busbar and the circuit board, allowing for efficient heat dissipation and electrical connectivity through large contact areas, with the busbar serving multiple functions including energy supply, heat dissipation, and mechanical protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If solid state power switches are used to control electric power supply in aircraft, then power control efficiency is improved, but heat generation increases causing overheating risk

Engineering Contradiction:
Improvepower control efficiencyVSAvoidheat generation
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent combines multiple functions into the busbar structure: electrical connection, mechanical support, and heat dissipation. The busbar is directly coupled to the solid state power switch, forming an integrated assembly where the same component that conducts electricity also serves as a heat sink and structural element, thereby addressing heat generation while maintaining power control efficiency

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The busbar is designed to perform multiple functions simultaneously: it provides electrical connectivity to the power switch, serves as a mechanical support structure, and acts as a heat dissipation pathway. This multi-functionality allows the system to maintain high power control efficiency while effectively managing the heat generated by the solid state power switches

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If separate components are used for electrical connection and heat dissipation, then functional effectiveness is improved, but device complexity and manufacturing costs increase

Engineering Contradiction:
Improvefunctional effectivenessVSAvoidcomponent quantity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the electrical connection function and heat dissipation function into a single busbar component. The busbar is directly coupled to the solid state power switch, eliminating the need for separate connection elements and heat sinks, thereby reducing device complexity while maintaining functional effectiveness through the multi-functional design

Inventive Principle:
Principle #5Merging (Combining)

3Temperature

If multiple separate components are used for power supply and heat dissipation, then heat dissipation efficiency is improved, but manufacturing costs and assembly complexity increase

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The busbar is designed as a universal component that simultaneously provides electrical power supply and heat dissipation functions. By making the busbar directly coupled to the solid state power switch and giving it a multi-functional design, the patent achieves effective heat dissipation while reducing the number of parts that need to be manufactured and assembled, thereby lowering manufacturing costs

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces heat dissipation efforts and manufacturing costs by using a single busbar to supply energy and dissipate heat from multiple solid state power switches, while maintaining a stable and efficient electrical connection, thus preventing overheating and enhancing mechanical protection.

Implementation Method 1

The at least one busbar comprises at least one busbar contact portion, which is configured for electrically contacting the power switch electric contact surface in order to allow transferring electricity and heat between the busbar and the at least one solid state power switch

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The at least one busbar comprises at least one busbar contact portion, which is configured for electrically contacting the power switch electric contact surface in order to allow transferring electricity and heat between the busbar and the at least one solid state power switch

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP4369872A1Solid state power switch assembly of an aircraft solid state power controller and method of providing a solid state power switch assembly for an aircraft solid state power controller
Publication Date: 2024.05.15 HS ELEKTRONIK SYST
  • EP4369872A1 patent drawingFigure 1
  • EP4369872A1 patent drawingFigure 2
  • EP4369872A1 patent drawingFigure 3

AI summary

A solid state power switch assembly (4) of an aircraft solid state power controller (2) comprises a circuit board (6), in particular a printed circuit board (6), at least one solid state power switch (8), and a busbar (18). The at least one solid state power switch (8) has a first side and an opposing second side. A power switch electric contact surface (10) is formed on the first side and the at least one solid state power switch (8) is arranged on the circuit board (6) with the second side facing the circuit board (6) and the first side facing away from the circuit board (6). The busbar (18) comprises at least one busbar contact portion (24) configured for electrically contacting the power switch electric contact surface (10) and at least one busbar mounting portion (20a, 20b), which is configured for be mounted to the circuit board (6), so that the at least one solid state power switch (8) is sandwiched between the at least one busbar contact portion (24) and the circuit board (6).