Air-flow-by Cooling Circuit Board Modules in Harsh Environments
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Solution Overview
Problem
Conventional cooling technologies for circuit board modules are not suitable for harsh environments like dusty or sandy conditions, as they require filtered air and do not provide adequate cooling power and temperature control.
Innovation Solution
The air-flow-by cooling technology uses unfiltered air to cool circuit board modules through a sealed casing with fins or channels on the cover plates, creating a Faraday cage for electrostatic protection and employing a heat spreader plate for efficient heat dissipation, allowing for effective cooling without filters in harsh environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional air cooling methods are used, then cooling function is provided, but filtered air is required which is not available in harsh environments
Solution Approach 1:
The patent extracts and removes the air filter component from the cooling system, replacing it with a direct air-flow-by cooling approach where unfiltered air flows across the circuit board. This eliminates the requirement for filtered air while maintaining cooling functionality, enabling operation in harsh environments where filtering is not feasible.
Solution Approach 2:
The patent introduces a cooling airflow as an intermediary medium that directly interacts with the circuit board surface. The air flow serves as a mediator to transfer heat from the circuit board to the environment without requiring filtration, bridging the gap between harsh environmental conditions and cooling requirements.
2Temperature
If existing cooling technologies are used, then cooling is provided, but adequate cooling power and temperature control are not achieved
Solution Approach 1:
The patent transitions from traditional point-source or localized cooling approaches to a surface-wide cooling method. The air-flow-by cooling technique distributes cooling across the entire circuit board surface, utilizing the two-dimensional surface area for heat dissipation. This dimensional approach significantly increases the effective cooling area and improves temperature control capability.
Solution Approach 2:
The cooling system is designed to provide universal cooling across the entire circuit board surface simultaneously. The air flow serves multiple functions: it cools multiple components across different locations, provides uniform temperature distribution, and maintains adequate cooling power rates across the whole board, making the system universally applicable to various component layouts.
3Reliability
If air filters are used for cooling, then cooling function is maintained, but system complexity and maintenance requirements increase
Solution Approach 1:
The patent removes the air filter and associated filtration system from the cooling architecture. This extraction simplifies the overall system structure, eliminates multiple components (filter elements, housing, seals), and reduces maintenance requirements while maintaining reliable cooling function through the direct air-flow-by approach.
Solution Approach 2:
The cooling system is designed to operate autonomously without requiring filter maintenance or replacement. The air-flow-by cooling method allows the system to self-regulate by utilizing ambient air flow directly across the circuit board, eliminating the need for manual filter intervention and reducing operational complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient cooling for circuit board modules in harsh environments, maintaining low component temperatures and preventing electrostatic interference, while being compatible with standard chassis and requiring minimal maintenance.
Implementation Method 1
a fluid, such as air, with the 'flow-by' cooling technology where fluid flows directly over the cover plates
Implementation Method 2
employing a heat spreader plate for efficient heat dissipation
Implementation Method 3
creating a Faraday cage for electrostatic protection
Data Source
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AI summary
Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.