Airflow Divider for Balanced Cooling in Modular Chassis
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Solution Overview
Problem
In modular chassis systems, achieving balanced airflow for effective cooling is challenging due to the need for large exhaust plenums and high-speed air turning, which increases chassis size and reduces cooling performance.
Innovation Solution
Incorporating an airflow divider in the exhaust air plenum, configured to maximize negative pressure and segment the airflow into multiple sections, optimizing airflow distribution from the intake to the output and over circuit cards, thereby reducing pressure drops and maintaining airflow efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If fans are distributed in a two dimensional matrix across the top of the chassis to ensure even airflow from front to back, then airflow distribution is improved, but additional plenum space is required which increases the overall size of the chassis
Solution Approach 1:
The exhaust air plenum is segmented into multiple sections using airflow dividers, which divide the plenum into front and rear sections. This segmentation allows for better airflow distribution without requiring additional plenum space, as each section can be optimized independently for its specific airflow requirements.
Solution Approach 2:
Instead of distributing fans in a two-dimensional matrix across the top of the chassis, the invention uses a one-dimensional arrangement of fans at the rear of the chassis combined with airflow dividers that create segmented flow paths. This dimensional change reduces the plenum space requirement while maintaining effective airflow distribution.
2Manufacturing precision
If air is turned at the point where speed is highest to achieve even airflow distribution, then airflow balance is improved, but an undesirable pressure drop occurs which negatively affects cooling performance
Solution Approach 1:
Airflow dividers are positioned upstream in the exhaust plenum to segment the airflow before it reaches the high-speed region near the fans. This preliminary segmentation prepares the airflow for smoother turning, reducing the pressure drop that would occur if turning were attempted at the highest speed point.
Solution Approach 2:
The exhaust plenum is divided into sections with different airflow characteristics. The front section handles airflow from the front of the chassis while the rear section handles airflow from the back, allowing each section to be optimized for its specific flow conditions and reducing overall pressure losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures balanced airflow distribution from front to back without increasing chassis height, maintaining overall airflow, and enhancing cooling performance, even in high-power systems like those consuming over 4 kW in a 10 RU chassis.
Implementation Method 1
the airflow divider is dimensioned and located in the exhaust air plenum to maximize negative pressure in front of the chassis, in the exhaust air plenum, and in back of the chassis, in the exhaust air plenum, wherein the maximize negative pressure causes balanced airflow from the intake air plenum to the output and over the circuit cards disposed in the chassis for cooling thereof
Data Source
AI summary
A chassis supporting a plurality of circuit cards in an electronic and/or optical system includes one or more fans at an output of an exhaust air plenum, wherein the one or more fans are configured to enhance airflow from an intake air plenum to the output; and an airflow divider disposed in the exhaust air plenum and attached or disposed to the chassis, wherein the airflow divider is dimensioned and located in the exhaust air plenum to segment the exhaust air plenum into multiple sections causing balanced airflow from the intake air plenum to the output and over the circuit cards disposed in the chassis for cooling thereof.