Airflow Ducting for Data Processor Cards
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Solution Overview
Problem
Data processing systems face issues with overheating due to heat generation from devices like system on a chip (SOC) units, leading to reduced processing capacity, increased energy costs, and decreased device density within server chassis due to the need for more cooling fans and reduced space for heat-generating devices.
Innovation Solution
An airflow ducting apparatus with airflow ducts mounted on data processor cards and a cooling fan manifold structure that provides controlled heat extraction through airflow passages defined by the baffle and circuit substrate, allowing for selective heat management and improved airflow within the server chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling fans are added to manage heat, then heat extraction capability is improved, but device density decreases due to space occupation
Solution Approach 1:
The airflow baffle divides the airflow path into multiple passages that correspond to different SOC unit positions, allowing targeted cooling for each unit without requiring additional fans. The baffle segments the airflow to match the segmented heat generation points.
Solution Approach 2:
The airflow baffle acts as an intermediary component between the heat-generating SOC units and the cooling airflow. It mediates the thermal management by directing airflow precisely where needed without requiring direct contact or additional active cooling components.
2Temperature
If more cooling components are added, then thermal management is improved, but processing capacity is reduced due to overheating limits
Solution Approach 1:
The airflow baffle is pre-configured with specific airflow passages and directions before the system operates. This preliminary airflow path configuration ensures that cooling is immediately effective when the system starts, preventing overheating from limiting processing capacity in the first place.
Solution Approach 2:
The airflow baffle utilizes the existing airflow generated by the system's cooling fans and directs it through the baffle's passages to automatically cool the SOC units. The system serves its own cooling needs without requiring additional active cooling components or external intervention.
3Temperature
If cooling infrastructure is expanded, then heat dissipation is improved, but energy consumption increases
Solution Approach 1:
The airflow baffle creates localized airflow passages that direct cooling air precisely to the SOC units generating heat. This local quality approach ensures efficient heat dissipation at the source without requiring energy-intensive cooling of the entire chassis or unnecessary airflow to non-heat-generating areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces adverse thermal effects, maintains uniform cooling across SOC units, and enhances data processing performance, power efficiency, and component reliability by managing heat generation and airflow within the server chassis.
Implementation Method 1
an airflow baffle mounted on the circuit substrate. The data processing units are spaced apart from each other along the circuit substrate. Side walls of the airflow baffle and the circuit substrate jointly define an airflow passage. The airflow baffle extends over the data processing units such that the data processing units are within the airflow passage.
Data Source
AI summary
A data processing system includes an enclosure, one or more airflow manifold structures within the enclosure, and a plurality of data processor cards mounted within the enclosure. Each one of the one or more airflow manifold structures has an air inlet portion and an air outlet portion. Each one of the data processor cards extends substantially parallel to each other one of the data processor cards. Each one of the data processor cards includes an airflow duct having an air inlet portion thereof covering a portion of the air outlet portion of at least one of the one or more airflow manifold structures and includes a plurality of data processing units within the airflow duct.