Airflow Estimation via Thermal Resistance and Temperature Sensing

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Solution Overview

Problem

Existing electronic systems face challenges in accurately estimating ambient airflow for effective heat dissipation, particularly in high-performance computing systems and data centers, where direct airflow measurement is costly and space-consuming.

Innovation Solution

An apparatus comprising an interface and a processor that receives temperature measurements from an integrated circuit (IC), a heatsink (HS), and ambient air. The processor estimates thermal resistances and calculates the airflow rate based on these measurements, allowing for controlled heat dissipation without the need for direct airflow sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If direct airflow sensors are used to measure airflow rate, then measurement precision is improved, but device complexity and cost increase

Engineering Contradiction:

Improveairflow measurement accuracyVSAvoidsystem complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent uses temperature as an intermediary parameter to indirectly measure airflow rate. Instead of directly measuring airflow with complex sensors, the system measures temperature differences between the heatsink and ambient air, which are caused by airflow. This intermediary measurement approach simplifies the system while maintaining measurement capability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces mechanical airflow sensors with a thermal-based measurement system. By using temperature sensors to detect temperature differences and calculating airflow from thermal resistance relationships, the system substitutes mechanical measurement components with thermal field-based measurement, reducing device complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If direct airflow sensors are installed in the case, then airflow measurement accuracy is improved, but the space required and cost increase

Engineering Contradiction:

Improveairflow measurement accuracyVSAvoidspace occupied

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent employs temperature as an intermediary variable that reflects airflow conditions without requiring physical airflow sensors in the airflow path. Temperature sensors can be placed on existing components like the heatsink, avoiding additional space requirements for sensor installation while still providing airflow measurement capability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heatsink and existing temperature sensors in the system are utilized to provide airflow measurement information. The system uses its own existing thermal components to serve the additional function of airflow measurement, eliminating the need for separate dedicated airflow sensing components and the space they would occupy.

Inventive Principle:

Principle #25Self-service

3Device complexity

If thermal resistance estimation is used to calculate airflow rate, then device complexity is reduced, but measurement precision may be affected

Engineering Contradiction:

Improvesystem complexityVSAvoidairflow estimation accuracy

Core Design Contradiction:

Device complexityVSMeasurement precision

Solution Approach 1:

The system uses feedback from temperature measurements to continuously estimate and update thermal resistance values. By monitoring temperature differences between the heatsink and ambient air and using these measurements to calculate thermal resistance, the system creates a feedback loop that adapts to changing airflow conditions, improving estimation accuracy while maintaining simple device architecture.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient heat dissipation in electronic systems by accurately estimating airflow rates, thereby improving electrical performance and reliability while reducing the need for costly airflow sensors.

Implementation Method 1

estimate a thermal resistance between the IC and the air

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a flow rate of the air flowing through the case for dissipating heat generated by the IC

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250126742A1Estimating ambient airflow based on temperature sensing

Publication Date: 2025.04.17 MELLANOX TECHNOLOGIES LTD(IL)

AI summary

An apparatus includes an interface and a processor. The interface is configured to receive measurements of a first temperature of an integrated circuit (IC), and a second temperature of air in a case that surrounds the IC. The processor is configured to: (a) estimate a thermal resistance between the IC and the air, and (b) estimate, based on (i) the thermal resistance between the IC and the air, and (ii) the first and second temperatures, a flow rate of the air flowing through the case for dissipating heat generated by the IC.