Airflow Guide With Integrated Power Conduits
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Solution Overview
Problem
In high-density information handling systems, traditional methods for routing electrical conduits within the chassis interfere with airflow, reducing the effectiveness of thermal management systems due to space constraints and design complexity.
Innovation Solution
An airflow guide with integrated electrical conduits is used to deliver electrical current from the power supply unit to heat-generating components, while forming an air plenum between the air mover and these components, thereby minimizing the impact of electrical conduits on airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If traditional power cables and bus bars are used to deliver electrical energy, then power delivery is achieved, but space is significantly consumed and airflow impedance is increased
Solution Approach 1:
The patent combines the airflow guide structure with electrical conduits into a single integrated component. The airflow guide walls contain embedded channels that simultaneously guide airflow and conduct electrical power to heat-generating components, eliminating the need for separate power cables and bus bars occupying additional space in the chassis.
Solution Approach 2:
The airflow guide structure serves multiple functions: it directs airflow from air movers to cooling components, provides structural support within the chassis, and simultaneously acts as an electrical conduit for power delivery. This multi-functionality reduces the number of separate components needed and optimizes space utilization.
2Use of energy by moving object
If traditional power cables and bus bars are used to deliver electrical energy, then power delivery is achieved, but airflow impedance is increased reducing thermal management effectiveness
Solution Approach 1:
The airflow guide structure combines the airflow guide walls with embedded electrical conduit channels. This integration allows airflow to flow through the guide structure itself rather than being blocked by separate power delivery components, significantly reducing airflow impedance while maintaining effective power delivery to components.
3Power
If multiple power layers or wider power plane within motherboard are used, then power delivery capacity is increased, but design complexity increases and signal routing is limited
Solution Approach 1:
The patent extracts the power delivery function from the motherboard's power layers and relocates it to the airflow guide structure. By moving electrical conduits out of the motherboard and embedding them in the airflow guide, the design reduces complexity within the motherboard while maintaining adequate power delivery capacity through the dedicated conduit channels.
Data Source
AI summary
An information handling system may include a heat-generating information handling resource, an air mover, a power supply unit, and an airflow guide. The airflow guide may include one or more features configured to, either alone or in combination with portions of a chassis of the information handling system, form an air plenum fluidically coupled between the air mover and the heat-generating information handling resource and electrical conduits integrated within the airflow guide configured to deliver electrical current from the power supply unit to the heat-generating information handling resource.