Alcohol-Based Resin Composition for Fine Pattern Shrinkage

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Solution Overview

Problem

Current microfabrication techniques face challenges in forming fine patterns smaller than 100 nm due to limitations in heat-dependent processes, inadequate pattern control, and low dry etching resistance, leading to inaccuracies and increased costs.

Innovation Solution

A resin composition containing a hydroxyl group, a crosslinking component, and an alcoholic solvent is used, which allows for precise pattern miniaturization through heat treatment and easy removal with an alkaline aqueous solution, enhancing etching resistance and reducing pattern defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If water-soluble resin is used for fine pattern formation, then pattern miniaturization is achieved, but dry etching resistance deteriorates

Engineering Contradiction:
Improvepattern miniaturizationVSAvoiddry etching resistance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the solvent parameter from water to alcohol, which fundamentally alters the resin's properties. The alcohol-soluble resin provides both fine pattern formation capability and improved dry etching resistance, resolving the contradiction between pattern miniaturization and etching resistance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite system combining alcohol-soluble resin with specific additives including crosslinking agents and surfactants. This composite formulation achieves both fine pattern resolution and enhanced dry etching resistance that neither component could achieve alone

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If heat treatment is applied for pattern shrinkage, then pattern miniaturization is achieved, but temperature control difficulty increases

Engineering Contradiction:
Improvepattern shrinkage controlVSAvoidtemperature uniformity
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent optimizes the heat treatment parameters by controlling temperature within a specific range (80-150°C) and time (30-180 seconds). This parameter control enables predictable pattern shrinkage while maintaining operational feasibility despite temperature control challenges

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If existing coating facilities are used for resin application, then equipment cost is reduced, but coating quality for fine patterns deteriorates

Engineering Contradiction:
Improveequipment costVSAvoidcoating uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent modifies coating parameters including thickness (30-200 nm), application method (spin coating, dip coating, or spray coating), and solvent composition to achieve fine pattern coverage using existing facilities. The alcohol-based solvent system enables better coating uniformity on fine patterns compared to water-based systems

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resin composition achieves accurate and economical miniaturization of resist patterns with low temperature dependency, excellent shape retention, and improved etching resistance, enabling the formation of precise trench patterns and holes on semiconductor substrates.

Implementation Method 1

a resin composition for forming fine patterns used for causing patterns formed by patterning to shrink by a heat treatment

Methodology Applied
Scientific EffectThermal contraction: Thermal Contraction

Implementation Method 2

owing to increased wettability for photoresist patterns due to the use of an alcoholic solvent

Methodology Applied
Scientific EffectWetting: Wetting

Implementation Method 3

treating the positive-tone resist with heat to form a reaction layer on the boundary of the resist pattern and the positive resist layer

Methodology Applied
Scientific EffectCrosslinking: Chemical Bonding

Data Source

PatentUS8715901B2Resin composition for forming fine pattern and method for forming fine pattern
Publication Date: 2014.05.06 JSR CORPORATION
  • US8715901B2 patent drawing
  • US8715901B2 patent drawing
  • US8715901B2 patent drawing

AI summary

A resin composition which, in forming a fine pattern by a heat treatment of a resist pattern formed by using a photoresist, can be applied onto the resist pattern, can cause the resist pattern to smoothly shrink by heat treatment, and can be easily washed away by a treatment with an alkaline aqueous solution, and a method for efficiently forming a fine resist pattern using the resin composition are provided. The resin composition comprises a resin containing a hydroxyl group, a crosslinking component, and an alcohol solvent containing water in an amount of 10 wt % or less for the total solvent, wherein the alcohol in the alcohol solvent is a monovalent alcohol having 1 to 8 carbon atoms.