ALD Barrier Coating for Fluid Handling Component Corrosion
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Solution Overview
Problem
Interior fluid wetted surfaces of fluid handling components in semiconductor substrate processing apparatuses are prone to corrosion and erosion from process gases and fluids, leading to contamination and processing defects.
Innovation Solution
A coating system using atomic layer deposition (ALD) or molecular layer deposition (MLD) to form a barrier coating on these surfaces, which includes a gas supply system for injecting and an exhaust system for removing deposition gases, ensuring protection from erosion and corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interior fluid wetted surfaces are exposed to process gases and fluids during semiconductor substrate processing, then the processing function is enabled, but corrosion and erosion occur leading to contamination and processing defects
Solution Approach 1:
A barrier coating layer is introduced as an intermediary between the process gases/fluids and the interior fluid wetted surfaces. This coating layer acts as a protective mediator that prevents direct contact between the corrosive/erosive process environment and the component surfaces, thereby eliminating corrosion and erosion while maintaining the fluid handling function
Solution Approach 2:
The barrier coating creates an inert protective environment on the interior surfaces by forming a chemically stable layer that resists reaction with corrosive process gases and fluids. This inert barrier prevents the harmful chemical and physical interactions that would otherwise cause corrosion and erosion of the underlying surfaces
2Reliability
If a barrier coating is applied to interior fluid wetted surfaces, then protection from corrosion and erosion is achieved, but the complexity of the coating system increases
Solution Approach 1:
The coating system is segmented into distinct functional modules: a gas supply system with separate injection ports for different precursor gases, an exhaust system with dedicated ports for removing excess gases and byproducts, and a barrier coating layer formed through sequential deposition steps. This segmentation allows each component to perform its specific function independently, simplifying the overall system design and operation
Solution Approach 2:
The barrier coating system is designed with multi-functionality to reduce overall complexity. The same coating apparatus and process steps can be used to form protective layers on various interior fluid wetted surfaces of different fluid handling components, making the system universally applicable across multiple components and processing scenarios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ALD or MLD barrier coating effectively reduces contamination and processing defects by providing a protective layer on the interior surfaces of fluid handling components, maintaining their integrity and preventing metal contamination during semiconductor substrate processing.
Implementation Method 1
a coating system for forming an atomic layer deposition (ALD) barrier coating or a molecular layer deposition (MLD) barrier coating on interior fluid wetted surfaces
Implementation Method 2
a coating system for forming an atomic layer deposition (ALD) barrier coating or a molecular layer deposition (MLD) barrier coating
Implementation Method 3
An exhaust system is in fluid communication with the process region of the fluid handling component wherein the exhaust system exhausts the process gases from the process region
Implementation Method 4
the ALD or MLD barrier coating protects the underlying fluid wetted surfaces from erosion and/or corrosion
Data Source
AI summary
A coating system for forming an atomic layer deposition (ALD) or a molecular layer deposition (MLD) barrier coating on interior fluid wetted surfaces of a fluid handling component for a vacuum chamber of a semiconductor substrate processing apparatus. The coating system includes the fluid handling component, wherein the interior fluid wetted surfaces define a process region of the coating system, a gas supply system in fluid communication with the process region of the component wherein the gas supply system supplies process gases to the process region of the component through the inlet port thereof such that an ALD or MLD barrier coating can be formed on the fluid wetted surfaces of the fluid handling component, and an exhaust system in fluid communication with the process region of the component wherein the exhaust system exhausts the process gases from the process region of the component through the outlet port thereof.


