ALD Doping Control via Surface Functionalization

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Solution Overview

Problem

Current Atomic Layer Deposition (ALD) techniques lack the ability to control the local environment and distribution of dopants in thin films, leading to inhomogeneous doping profiles and reduced doping efficiency, especially for low dopant concentrations.

Innovation Solution

Incorporating an in-situ surface functionalization step using alkyl alcohols, carboxylic acids, and beta diketonates to control the growth rate and dopant distribution in ALD, allowing for precise control of dopant placement and maintaining film homogeneity and conformality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional ALD techniques are used for dopant insertion, then the process is simple and direct, but the dopant distribution becomes inhomogeneous and doping efficiency decreases

Engineering Contradiction:
Improvedopant distribution uniformityVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by introducing surface functionalization groups (such as -OH, -COOH, -NH2) onto the substrate surface before the main ALD doping process. This pre-functionalization step modifies the surface chemistry to enable controlled dopant attachment, ensuring homogeneous dopant distribution from the outset rather than attempting to correct inhomogeneity after deposition.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses surface functionalization groups as intermediaries between the substrate and the dopant species. These functional groups act as mediators that facilitate controlled interaction between the dopant precursors and the substrate surface, enabling precise dopant placement and uniform distribution while maintaining process simplicity through the self-limiting nature of ALD reactions.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If ALD operates at saturation coverage to maintain homogeneity and conformality, then film quality is preserved, but dopant control and distribution precision are lost

Engineering Contradiction:
Improvedopant concentration controlVSAvoidfilm homogeneity
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by creating spatially varying surface functionalization densities or types across the substrate surface. Different regions can have different concentrations or types of functional groups (e.g., varying -OH versus -COOH densities), which enables precise local control of dopant attachment while maintaining overall film homogeneity and conformality through the ALD process's self-limiting nature.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances dopant control and efficiency, enabling the growth of doped thin films with higher doping efficiencies and achieving submonolayer conformal coatings on high aspect ratio features while maintaining precise dopant concentrations.

Implementation Method 1

The functional groups incorporated on the surface must be chemically compatible with the precursors involved in the ALD step, and reactive to at least one of the other species

Methodology Applied
Scientific EffectChemisorption: Chemisorption

Implementation Method 2

Atomic layer deposition (ALD) is a thin film growth method using alternating, self limiting reactions between gaseous precursors and a solid surface to deposit materials monolayer-by-monolayer

Methodology Applied
Scientific EffectAtomic layer deposition: Chemical Vapour Deposition

Data Source

PatentUS8951615B2Doping control by ALD surface functionalization
Publication Date: 2015.02.10 UCHICAGO ARGONNE LLC
  • US8951615B2 patent drawing
  • US8951615B2 patent drawing
  • US8951615B2 patent drawing

AI summary

Systems and methods for producing a material of desired thickness. Deposition techniques such as atomic layer deposition are alter to control the thickness of deposited material. A funtionalization species inhibits the deposition reaction.