Film-Forming Composition for ALD Using Dimethylethylamine Solvent
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Solution Overview
Problem
Solid materials are not effectively used as film-forming compositions in atomic layer deposition due to issues with viscosity and uniformity, particularly with high viscosity liquids that lead to reduced film uniformity and step coverage.
Innovation Solution
A film-forming composition comprising a precursor and dimethylethylamine, where the precursor is represented by specific formulas including Zr, Hf, or Ti, and dimethylethylamine is used in a weight ratio of 1:99 to 99:1, improving viscosity and volatility, allowing for uniform film deposition through atomic layer deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If high viscosity liquid materials are used as film-forming composition, then the material can be delivered through liquid delivery system, but the uniformity and step coverage of the film are reduced
Solution Approach 1:
The patent changes the physical-chemical parameters of the film-forming composition by selecting specific precursors with optimized molecular structures and combining them with appropriate solvents. This reduces the viscosity of the liquid composition while maintaining its ability to be delivered through the liquid delivery system, thereby improving both deliverability and film uniformity simultaneously
Solution Approach 2:
The patent creates a composite film-forming composition by combining the metal precursor with a solvent. This composite system allows the composition to maintain liquid state for delivery while the solvent prevents excessive viscosity, ensuring both ease of operation through the liquid delivery system and manufacturing precision in terms of film uniformity and step coverage
2Reliability
If solid materials are used as film-forming composition, then material purity can be maintained, but the materials cannot be properly dispersed in the chamber for uniform deposition
Solution Approach 1:
The patent introduces a solvent as an intermediary substance that bridges the solid precursor material and the gas phase deposition environment. The solvent dissolves the solid precursor to create a liquid composition that can be properly dispersed in the chamber, while the solvent itself is designed to evaporate completely during deposition, leaving only the pure metal material on the substrate. This resolves the contradiction by maintaining material purity while enabling proper dispersion for uniform film formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances film uniformity and step coverage, increases adsorption efficiency, and reduces process time by using a solvent like dimethylethylamine, which improves the thermal stability and volatility of the film-forming composition, leading to improved film properties.
Implementation Method 1
preparing a liquid-phase composition by dissolving the precursor in the dimethylethylamine
Implementation Method 2
vaporizing the liquid-phase composition, and wherein the introducing of the liquid-phase composition includes introducing the vaporized liquid-phase composition into the chamber
Implementation Method 3
depositing a film on a substrate by using a film-forming composition, wherein the film is deposited by Atomic Layer Deposition
Implementation Method 4
increases adsorption efficiency
Data Source
AI summary
A film-forming composition including a 3-intracyclic cyclopentadienyl precursor and dimethyethylamine is useful for Atomic Layer Deposition, and improves viscosity and volatility while maintaining unique features of metal precursors.