ALD Gas Flow Guide Design for Uniform Film Thickness
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Solution Overview
Problem
Atomic layer deposition (ALD) chambers face issues with non-uniform distribution of process gases across the substrate, leading to uneven film thickness and residual gases affecting film quality, as well as prolonged purge times that decrease throughput.
Innovation Solution
The implementation of a gas flow inlet guide with a flow modulator and multiple channels to ensure uniform gas distribution and a gas flow outlet guide with distinct channels to facilitate effective purging, reducing residual gases and purge time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional gas flow delivery is used in ALD chamber, then the structure is simple, but the process gas is not uniformly distributed across the substrate leading to non-uniform film thickness
Solution Approach 1:
The gas flow inlet guide is divided into multiple channels (first channel, second channel, third channel) with different cross-sectional areas. Each channel delivers process gas to a specific region of the substrate, enabling controlled non-uniform distribution that achieves uniform film thickness across the entire substrate surface.
Solution Approach 2:
Different channels are designed with different cross-sectional areas to provide different gas flow rates to different regions of the substrate. The first channel has a larger cross-sectional area for higher flow to regions needing more gas, while the second and third channels have smaller areas for lower flow to regions needing less gas, achieving local optimization of gas distribution.
2Manufacturing precision
If conventional gas flow outlet is used, then the structure is simple, but process gases are not effectively exhausted leading to residual gases affecting film quality
Solution Approach 1:
The gas flow outlet guide is segmented into multiple outlets (first outlet, second outlet, third outlet) corresponding to different channels. This segmentation allows independent optimization of exhaust paths for different gas flow regions, ensuring that process gases are effectively removed from each region without leaving residual gases that would affect film quality.
Solution Approach 2:
The gas flow outlet guide acts as an intermediary structure between the processing chamber and the vacuum pump. It provides dedicated exhaust paths for different gas flow regions, mediating the removal of process gases and preventing residual gases from contaminating the film deposition process.
3Productivity
If conventional purging method is used, then the system is simple, but the purge time is prolonged decreasing throughput
Solution Approach 1:
The purging process is segmented into parallel paths through the first outlet, second outlet, and third outlet. Multiple channels can purge simultaneously rather than sequentially, significantly reducing the total purge time required to remove residual process gases and improving overall system throughput.
Solution Approach 2:
The gas flow outlet guide maintains continuous exhaust paths during the purging process, allowing process gases to be removed continuously and efficiently. This continuous action prevents the accumulation of residual gases and reduces the time required to achieve complete purging of the chamber.
Data Source
AI summary
Embodiments described herein provide a chamber having a gas flow inlet guide to uniformly deliver process gas and a gas flow outlet guide to effectively purge process gasses and reduce purge time. The chamber includes a chamber body having a process gas inlet and a process gas outlet, a lid assembly, a process gas inlet and a process gas outlet configured to be in fluid communication with a processing region in the chamber, a gas flow inlet guide disposed in the process gas inlet, and a gas flow outlet guide disposed in the process gas outlet. The gas flow inlet guide includes a flow modulator and at least two first inlet guide channels having first inlet guide channel areas that are different. The gas flow outlet guide includes at least two first outlet guide channels having first outlet guide channel areas that are different.