ALD Coating of Gas Line Inner Walls for Conformal Film Coverage
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Solution Overview
Problem
Existing methods for depositing protective coatings on semiconductor process chamber components with high aspect ratios or complex geometries, such as thermal spray, sputtering, and plasma spray, result in poor quality films and non-conformal coatings, and special fixtures often lead to defects.
Innovation Solution
An apparatus and method using atomic layer deposition (ALD) to coat the inner walls of gas lines, utilizing an oven with inlet and exhaust ports, fluid distribution assemblies, and a foreline, allowing for conformal coatings on gas lines with various configurations and sizes, including those with high aspect ratios, through controlled pressure and temperature conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermal spray, sputtering, or plasma spray techniques are used to deposit protective coatings, then the coating process can be performed, but poor quality films and non-conformal coatings are obtained on components with high aspect ratios or complex geometries
Solution Approach 1:
The patent replaces mechanical coating methods (thermal spray, sputtering, plasma spray) with a chemical vapor deposition process using atomic layer deposition. This substitution enables conformal coating of complex geometries by using chemical reactions and vapor-phase precursor delivery instead of mechanical particle projection, achieving uniform film thickness on high aspect ratio features
Solution Approach 2:
The patent employs a fluid distribution assembly with gas flow delivery systems to transport precursor vapors through the coating chamber. The pneumatic delivery method uses controlled gas flows to distribute precursor chemicals uniformly throughout the chamber, enabling conformal deposition on complex geometries that mechanical methods cannot achieve
2Adaptability or versatility
If special fixtures are used to direct precursor gases into complex internal features of gas lines, then coating can be attempted, but poor quality films and non-conformal films are deposited
Solution Approach 1:
The patent changes the physical parameters of the coating process by using vapor-phase precursors at controlled temperatures and pressures. By adjusting temperature gradients and gas flow rates, the process achieves uniform precursor distribution into complex internal features without requiring special fixtures, producing high quality conformal films
Solution Approach 2:
The patent segments the coating process into sequential atomic layer deposition cycles, where precursor vapor is delivered in controlled pulses followed by purge steps. This segmentation allows uniform penetration of precursor gases into complex internal features and ensures conformal coating without requiring mechanical fixtures
3Productivity
If conventional coating methods are used on high aspect ratio features, then the process can be completed, but the coating quality and uniformity are insufficient
Solution Approach 1:
The patent replaces mechanical coating delivery systems with a chemical vapor deposition approach using atomic layer deposition. This substitution enables simultaneous uniform coating of high aspect ratio features by relying on chemical reactions and vapor diffusion rather than mechanical particle transport, achieving both productivity and coating uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ALD process achieves conformal coatings with good step coverage, reducing particle generation and improving the life of gas lines while increasing throughput and reducing precursor consumption.
Implementation Method 1
an apparatus for coating a plurality of gas lines via an ALD process
Data Source
AI summary
Embodiments of an apparatus for coating a plurality of gas lines are provided herein. In some embodiments, an apparatus for coating a plurality of gas lines via an ALD process includes: an oven having an enclosure that defines an interior volume configured to house the plurality of gas lines, the enclosure having a door configured for transferring the plurality of gas lines into and out of the interior volume; a plurality of inlet ports disposed through a first wall of the enclosure; a plurality of exhaust ports disposed through a second wall of the enclosure; a fluid panel disposed outside of the oven and coupled to the plurality of inlet ports via corresponding ones of a plurality of fluid distribution assemblies; and a foreline disposed outside of the oven and coupled to the plurality of exhaust ports.


