ALD Mixed Film Composition Control via Adsorption Suppression

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Solution Overview

Problem

Existing film-forming methods using atomic layer deposition (ALD) struggle to regulate film composition without affecting film thickness and composition uniformity when forming mixed films of two or more compounds, leading to issues with concentration uniformity and increased film thickness due to uncontrollable adsorption of raw material gases.

Innovation Solution

A film-forming method where a first film is formed by alternately supplying a first raw material gas and an oxidizing gas, followed by a second film formed by adsorbing the first raw material gas to suppress the adsorption of the second raw material gas, allowing for precise control of film composition without increasing film thickness or compromising uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the conventional ALD method of alternately forming each compound film is used, then a mixed film can be formed, but the film composition cannot be precisely regulated without affecting film thickness and composition uniformity

Engineering Contradiction:
Improvefilm composition regulationVSAvoidcomposition uniformity
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The film formation process is segmented into distinct cycles where each cycle forms a unit film with controlled composition. By dividing the mixed film formation into multiple unit film formations with different raw material gas supply ratios, precise composition regulation is achieved while maintaining overall uniformity through the systematic repetition of these segmented cycles.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The raw material gas supply ratios and process parameters are changed between different unit film formation cycles to achieve desired composition gradients. By systematically varying parameters such as gas flow rates, temperature, and pressure across different cycles, precise composition control is realized without compromising film thickness uniformity.

Inventive Principle:
Principle #35Parameter changes

2Length of stationary object

If the number of ALD cycles is increased to regulate film thickness, then the desired thickness can be achieved, but the concentration uniformity of elements in the mixed film deteriorates

Engineering Contradiction:
Improvefilm thicknessVSAvoidconcentration uniformity
Core Design Contradiction:
Length of stationary objectVSStability of the object's composition

Solution Approach 1:

Preliminary actions are taken within each ALD cycle to ensure complete adsorption and reaction before proceeding to the next cycle. By充分 supplying raw material gases and reaction gases within each cycle and ensuring complete surface coverage before advancing, the method maintains concentration uniformity even when multiple cycles are performed to achieve the desired film thickness.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The ALD process maintains continuous useful action through optimized cycle design where each cycle completes the full adsorption-reaction sequence without interruption. This continuity ensures that element concentration remains uniform throughout the film thickness as each cycle contributes equally to the overall film structure.

Inventive Principle:
Principle #20Continuity of useful action

3Quantity of substance

If raw material gas supply is increased to achieve desired composition, then the composition ratio can be adjusted, but the film thickness increases uncontrollably

Engineering Contradiction:
Improvecomposition ratioVSAvoidfilm thickness
Core Design Contradiction:
Quantity of substanceVSLength of stationary object

Solution Approach 1:

The raw material gas supply is applied periodically in controlled cycles rather than continuously. By supplying raw material gases for specific durations within each cycle and then pausing for reaction and purge phases, the method achieves precise composition ratios while controlling the total film thickness through the number and duration of cycles.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The gas supply system operates dynamically with adjustable flow rates, pulse durations, and cycle frequencies. This dynamic control allows real-time adjustment of composition ratios independent of film thickness, as the system can vary gas supply parameters within each cycle without directly proportionally increasing the deposited film thickness.

Inventive Principle:
Principle #15Dynamics

4Area of stationary object

If the adsorption of raw material gas is enhanced to improve film coverage, then the film coverage is improved, but the concentration uniformity of elements deteriorates

Engineering Contradiction:
Improvefilm coverageVSAvoidconcentration uniformity
Core Design Contradiction:
Area of stationary objectVSStability of the object's composition

Solution Approach 1:

Preliminary anti-action is applied by controlling the adsorption phase to achieve complete surface coverage while preventing excessive adsorption that would lead to non-uniform concentration. By carefully limiting the adsorption time and gas flow rate to achieve monolayer coverage without over-adsorption, the method maintains both complete film coverage and uniform element concentration.

Inventive Principle:
Principle #9Preliminary anti-action

Solution Approach 2:

The mechanical adsorption process is replaced and controlled through chemical reaction mechanisms where raw material gases react specifically with surface sites. This chemical substitution ensures uniform distribution of elements as the reaction proceeds uniformly across the substrate surface, maintaining both complete coverage and concentration uniformity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the formation of mixed films with a desired composition and thickness, reducing the concentration of specific elements to extremely low levels without non-uniformity, using ALD to regulate the adsorption of raw materials effectively.

Implementation Method 1

supplying the first raw material gas to the substrate and causing the first raw material gas to be adsorbed on the substrate to suppress the adsorption of the second raw material gas

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

forming a first film containing a first element on a substrate by performing an operation of forming a unit film on the substrate a plurality of times, the operation including a sub-step of supplying a first raw material gas containing the first element to the substrate and causing the first raw material gas to be adsorbed on the substrate and a sub-step of supplying a first reaction gas to the substrate and causing the first reaction gas to react with the first raw material gas

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Data Source

PatentUS12018370B2Film-forming method and film-forming apparatus
Publication Date: 2024.06.25 TOKYO ELECTRON LTD
  • US12018370B2 patent drawing
  • US12018370B2 patent drawing
  • US12018370B2 patent drawing

AI summary

A film-forming method includes: forming a first film by performing an operation of forming a unit film a plurality of times, the operation including sub-step of supplying a first raw material gas containing a first element to a substrate and causing the first raw material gas to be adsorbed thereon, and sub-step of supplying a first reaction gas to the substrate; and forming a second film on the substrate by performing an operation of forming a unit film at least once, the operation including sub-step of supplying a second raw material gas containing a second element to the substrate and causing the second raw material gas to be adsorbed thereon, and sub-step of supplying a second reaction gas to the substrate, wherein a mixed film is formed by performing the forming the first film and the forming the second film, respectively once, or a plurality of times.