Atomic Layer Deposition Nozzle Array for Large Substrate Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As the size of display panels increases, the size of atomic layer deposition apparatuses also grows, leading to longer tact times, increased gas usage, and decreased thin film uniformity due to the need for larger buffer plates and increased substrate movement.
Innovation Solution
The apparatus features a gas spray unit with alternately arranged source and reactant gas nozzles, and a susceptor unit that moves in a reciprocating motion corresponding to the width of the nozzles, allowing for efficient deposition of monolayers with minimized buffer plate length and reduced apparatus size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the size of display panel increases, then the substrate size increases, but the apparatus size increases leading to longer tact time
Solution Approach 1:
The gas spray unit is divided into multiple independent nozzle units that can spray gas to different regions of the substrate simultaneously. This segmentation allows parallel processing across the substrate surface, enabling larger substrates to be processed without proportionally increasing the tact time, as multiple regions receive gas treatment at the same time rather than sequentially
Solution Approach 2:
The patent transitions from linear substrate movement through a single gas spray region to a two-dimensional array of nozzle units that can cover the entire substrate surface. By arranging nozzles in multiple rows and columns, the system processes the substrate in parallel across the surface area rather than requiring the substrate to travel through a long linear path, thus reducing tact time for large substrates
2Manufacturing precision
If buffer plates are arranged at both sides of the substrate to maintain fixed distance, then the distance uniformity is improved, but the apparatus size increases
Solution Approach 1:
The buffer plates are designed to serve multiple functions: they maintain the fixed distance between the gas spray unit and substrate, provides structural support for the substrate, and define the processing region boundaries. This multi-functionality eliminates the need for separate distance-maintaining structures, reducing the overall apparatus size while preserving distance uniformity
Solution Approach 2:
The system allows the substrate to move dynamically in and out of the gas sprayed region while the buffer plates maintain the fixed distance relationship. The buffer plates are positioned to work with the substrate's motion, providing distance maintenance only when needed (when substrate is within or entering/exiting the region) rather than requiring the entire apparatus to be sized for maximum substrate position
3Manufacturing precision
If the length of buffer plate increases to match substrate length, then the distance maintenance is improved, but the gas usage increases
Solution Approach 1:
Gas is sprayed only to the specific region where the substrate is located and where deposition is needed, rather than spraying to the entire length of the buffer plates. The gas spray nozzles are positioned and oriented to deliver gas precisely to the substrate surface, minimizing gas waste to areas where no substrate exists. This localised gas delivery maintains distance uniformity through proper substrate positioning while significantly reducing overall gas consumption
4Adaptability or versatility
If the apparatus size increases for larger substrates, then the substrate processing capability is improved, but the thin film uniformity decreases
Solution Approach 1:
The gas spray unit is segmented into multiple nozzle units distributed across the substrate surface, with each nozzle providing localized gas delivery. This segmentation ensures that even on large substrates, the gas concentration and deposition conditions remain relatively uniform across different regions, as each area receives targeted gas supply from its corresponding nozzle rather than relying on gas distribution over a large distance from a single source
Solution Approach 2:
The substrate is moved periodically in and out of the gas sprayed region in a controlled manner, allowing for uniform exposure of different substrate areas to the gas phase over time. This periodic motion, combined with the segmented nozzle arrangement, ensures that all regions of the large substrate receive equivalent deposition conditions, maintaining thin film uniformity across the entire substrate surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the volume of the deposition chamber, shortens deposition time, decreases gas usage, and enhances the uniformity and stability of the thin film deposited on substrates, while maintaining the ability to process larger substrates.
Implementation Method 1
In ALD method, source gas and reactant gas are applied periodically, chemical exchange takes place, and a thin film is formed with very high density
Implementation Method 2
spraying a source gas and a reactant gas onto a substrate disposed on a susceptor unit using at least one source gas spray nozzle and at least one reactant gas nozzle
Data Source
AI summary
A method of depositing a layer includes spraying a source gas and a reactant gas onto a substrate disposed on a susceptor unit using at least one source gas spray nozzle and at least one reactant gas nozzle to form a first source gas region and a first reactant gas region on the substrate, respectively, moving the susceptor unit by a distance corresponding to a width of the source gas spray nozzle or a width of the reactant gas spray nozzle in a first direction, and spraying the source gas and the reactant gas onto the first reactant gas region and the first source gas region using the source gas spray nozzle and the reactant gas nozzle, respectively, to form a first monolayer.