ALD Inner Tube and Nozzle Layout for Uniform Step Coverage
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Solution Overview
Problem
The challenge in semiconductor manufacturing is forming a thin film with sufficient step coverage on substrates due to reduced line widths and film thickness, exacerbated by difficulties in supplying and discharging process gases effectively during atomic layer deposition.
Innovation Solution
A semiconductor manufacturing apparatus with a process chamber design that includes a boat, inner tube, and nozzle system, featuring asymmetrical gas injection ports and slits with varying dimensions and angles to optimize gas flow and distribution, enhancing the supply efficiency of process gases onto substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional symmetrical gas injection ports and slits are used, then the structure is simple and easy to manufacture, but the process gas is not sufficiently supplied to and discharged from the atomic layer deposition, reducing supply efficiency
Solution Approach 1:
The gas injection port is designed with asymmetrical dimensions where the width in the first direction differs from the width in the second direction. Similarly, the slit has asymmetrical dimensions with different widths in the first and second directions. This asymmetry optimizes the gas flow path and distribution, enabling sufficient supply and discharge of process gas during atomic layer deposition, thereby improving supply efficiency without excessive structural complexity.
2Productivity
If the line width of pattern is reduced to increase integration, then the area occupied by unit cell is reduced, but it becomes very difficult to form the substrate to have a sufficient step coverage
Solution Approach 1:
The asymmetrical gas injection port and slit design creates non-uniform gas flow distribution that is optimized for local conditions. The different widths in the first and second directions allow for tailored gas delivery to different regions of the substrate, ensuring sufficient step coverage even when line widths are reduced to increase integration level.
3Productivity
If conventional gas injection ports with equal widths are used, then the manufacturing is simple, but the dispersion and supply efficiency of process gas is insufficient
Solution Approach 1:
The gas injection port features asymmetrical dimensions with different widths in the first and second directions. This design optimizes gas dispersion and supply efficiency by creating more effective gas flow patterns, while still maintaining manufacturability through straightforward dimensional specifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves the supply efficiency and dispersion of process gases, increasing the amount of gas reaching the substrate and maintaining uniform film deposition, thereby addressing the challenge of step coverage.
Implementation Method 1
The gas injection port includes a first inlet and a first outlet... through which the process gas is directed towards the slit
Implementation Method 2
The apparatus improves the supply efficiency and dispersion of process gases, increasing the amount of gas reaching the substrate
Implementation Method 3
The atomic layer deposition injects a source gas and a reactive gas onto a substrate to grow the thin film
Data Source
AI summary
A semiconductor manufacturing apparatus including a process chamber and a boat having a support member supporting substrates arranged in a first direction. An inner tube encloses the boat and includes a slit along a side wall. A nozzle supplies a process gas and includes a gas injection port at a position corresponding to the slit. The gas injection port includes a first inlet and first outlet. The slit includes a second inlet and second outlet. A distance to an end of the first inlet from a center line that connects a center of the first inlet and a center of the second outlet is different from the distance from the center line to an end of the first outlet and/or a distance from the center line to an end of the second inlet is different from a distance from the center line to an end of the second outlet.