Atomic Layer Deposition Apparatus Parallel Substrate Handling
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Solution Overview
Problem
Existing atomic layer deposition (ALD) apparatuses face inefficiencies in loading and unloading substrates due to single transfer robots, leading to time delays and reduced throughput, especially when handling multiple substrates, which affects productivity.
Innovation Solution
The development of an ALD apparatus with a transfer robot capable of simultaneously loading and unloading multiple substrates, featuring a buffer system to maintain substrate multiples and prevent extra substrates from accumulating, along with a sensor for secure seating and a gas spraying unit with exhaust mechanisms to optimize the deposition process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If one transfer robot is used to load and unload substrates, then the device complexity is reduced, but the productivity decreases due to sequential handling of substrates
Solution Approach 1:
Multiple transfer robots are combined to work simultaneously on different substrates. The system integrates several transfer robots (e.g., first transfer robot, second transfer robot) that can load and unload substrates in parallel, transforming the sequential operation into concurrent operations to improve productivity without significantly increasing overall system complexity
Solution Approach 2:
The substrate handling process is segmented into multiple independent tasks performed by different transfer robots. Each robot handles specific substrates or specific operations (loading, unloading, transporting), allowing simultaneous execution of multiple operations rather than a single sequential process
2Device complexity
If substrates are handled one by one by a single transfer robot, then the device structure is simplified, but the time required for loading and unloading increases
Solution Approach 1:
The system maintains continuous substrate handling operations by having multiple transfer robots work simultaneously and continuously. While one robot is loading a substrate, another robot can be unloading or transporting a different substrate, eliminating idle time and ensuring continuous productive action without requiring complex sequential coordination
Solution Approach 2:
Substrates are prepared and positioned in advance by different transfer robots before the actual deposition process begins. The first transfer robot can load substrates onto the susceptor while the second transfer robot prepares additional substrates or removes processed ones, performing preliminary actions that prevent time delays in the overall process
3Productivity
If multiple substrates are processed simultaneously, then the productivity is improved, but the device complexity increases due to additional transfer robots
Solution Approach 1:
The transfer robots are designed with multi-functionality to perform multiple tasks including loading substrates onto the susceptor, unloading processed substrates, transporting substrates between chambers, and positioning substrates. This universality allows a relatively small number of robots to handle multiple substrates simultaneously without requiring a separate dedicated robot for each function, thus improving productivity while controlling device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces substrate handling time, prevents delays, and enhances the overall throughput and productivity of the deposition process by enabling efficient transfer and processing of multiple substrates simultaneously.
Implementation Method 1
the ALD may inject a single gas element into the process chamber to purge the injected gas element, allow only a physically deposited gas to remain on a surface of a heated substrate, and inject other gas elements into the process chamber to thereby deposit a product of chemical reaction generated on the surface of the substrate
Implementation Method 2
each of the plurality of process chambers including a gas spraying unit having an exhaust portion by which an exhaust gas is drawn in from inside the process chamber and the drawn-in gas is exhausted above the process chamber
Data Source
AI summary
An atomic deposition apparatus is provided for simultaneously loading/unloading a plurality of substrates. The atomic deposition apparatus which may load/unload the plurality of substrates when transmitting the plurality of substrates to a process module, includes a loading/unloading module for loading/unloading a substrate, a process module including a plurality of process chambers for simultaneously receiving a plurality of substrates and performing a deposition process, each of the plurality of process chambers including a gas spraying unit having an exhaust portion by which an exhaust gas is drawn in from inside the process chamber and the drawn in gas is exhausted above the process chamber, and a transfer module including a transfer robot provided between the loading/unloading module and the process module, the transfer robot being adopted for simultaneously holding the plurality of substrates while transporting the substrate.