ALD Valve Diaphragm Sensing for Precursor Flow Failure Detection

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Solution Overview

Problem

Atomic layer deposition (ALD) tools face issues with unopened valve failures in vapor delivery systems, leading to reduced precursor flow, which causes thickness and uniformity problems on semiconductor substrates, increasing scrap and device failures, and reducing processing quality and yields.

Innovation Solution

Incorporating a sensor in the valve to monitor the diaphragm position and flow, enabling early detection of unopened valve failures and quick termination of the ALD operation to prevent further processing with faulty conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sensor is added to monitor diaphragm position and flow, then reliability of precursor delivery is improved, but device complexity increases

Engineering Contradiction:
Improveprecursor delivery reliabilityVSAvoidvalve system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A sensor is integrated into the valve assembly to detect the diaphragm position and provide real-time feedback about precursor flow status. The sensor generates sensor data that is transmitted to a controller, which can then detect unopened valve failures and terminate ALD operations before they cause substrate defects. This feedback mechanism directly improves precursor delivery reliability by enabling continuous monitoring and early failure detection.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The sensor acts as an intermediary element between the diaphragm and the control system. It converts physical diaphragm position into electrical sensor data that can be processed by the controller. This intermediary component enables indirect observation of valve status without requiring direct mechanical contact or complex measurement systems, thus improving reliability while adding minimal complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If unopened valve failures are detected early, then manufacturing precision is improved, but loss of time increases due to operation termination

Engineering Contradiction:
Improvefilm thickness precisionVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The sensor continuously monitors diaphragm position during ALD operations, enabling early detection of unopened valve failures before they can cause significant film thickness deviations. By detecting failures in real-time rather than after processing completes, the system can terminate operations promptly, minimizing both the time lost to failures and the precision degradation that would otherwise occur.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

When a failure is detected via sensor data, the controller immediately terminates the ALD operation, skipping the remaining processing steps. This rapid response prevents the accumulation of further defects and minimizes the time spent on failed processing cycles, thereby maintaining manufacturing precision while limiting time loss.

Inventive Principle:
Principle #21Skipping (Rushing through)

Data Source

PatentUS20240379471A1Semiconductor processing tool and methods of operation
Publication Date: 2024.11.14 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240379471A1 patent drawing
  • US20240379471A1 patent drawing
  • US20240379471A1 patent drawing

AI summary

A diaphragm position of a valve may be detected and/or determined such that operation of the diaphragm may be monitored. A sensor included in the valve may generate sensor data that may be used to monitor the position of the diaphragm, which in turn may be used to determine a flow of a fluid through the valve. In this way, the sensor may be used to determine whether the diaphragm is properly functioning, may be used to identify and detect failures of the diaphragm, and/or may be used to quickly terminate operation of an associated deposition tool. This may reduce semiconductor substrate scrap, may reduce device failures on semiconductor substrates that are processed by the deposition tool, may increase semiconductor processing quality of the deposition tool, and/or may increase semiconductor processing yields of the deposition tool.