ALD Valve Diaphragm Feedback for Unopened Precursor Flow Failures

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Atomic layer deposition (ALD) tools face issues with unopened valve failures in vapor delivery systems, leading to reduced precursor flow, which causes thickness and uniformity problems on semiconductor substrates, increasing scrap and device failures, and reducing processing quality and yields.

Innovation Solution

Incorporating a sensor in the valve to monitor the diaphragm position and flow, enabling quick detection of unopened valve failures and immediate termination of the ALD operation to prevent further processing with faulty conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sensor is added to monitor diaphragm position and flow, then detection capability and reliability are improved, but device complexity increases

Engineering Contradiction:
Improvedetection capabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A sensor is integrated into the valve assembly to detect diaphragm position and provide feedback signals to a controller. This enables real-time monitoring of valve operation and detection of unopened valve failures, improving system reliability through continuous feedback without requiring complex external monitoring systems.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The sensor is merged with the valve assembly, integrating the detection function directly into the existing valve structure. This combination reduces the need for separate monitoring components and simplifies the overall system architecture while maintaining effective detection capability.

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If unopened valve failures are not detected, then device complexity remains low, but manufacturing precision deteriorates due to thickness and uniformity problems

Engineering Contradiction:
Improvefilm thickness controlVSAvoidmonitoring system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The sensor provides real-time feedback on diaphragm position, enabling the controller to detect unopened valve failures before they affect film deposition. This early detection prevents thickness and uniformity deviations, maintaining manufacturing precision through proactive monitoring rather than reactive correction.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The monitoring system detects valve failures in advance, before they impact the ALD process outcome. By identifying unopened valve conditions during precursor delivery rather than after film deposition, the system takes preliminary action to prevent manufacturing defects.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If ALD operation continues with unopened valve failures, then productivity is maintained, but processing quality deteriorates leading to increased scrap

Engineering Contradiction:
Improveprocessing qualityVSAvoidsubstrate yield
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The sensor-controller feedback system continuously monitors valve operation and automatically detects unopened valve failures. When a failure is detected, the system can immediately alert operators or terminate the ALD process, preventing production of defective substrates and maintaining high processing quality and yield.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS12131962B2Semiconductor processing tool and methods of operation
Publication Date: 2024.10.29 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12131962B2 patent drawing
  • US12131962B2 patent drawing
  • US12131962B2 patent drawing

AI summary

A diaphragm position of a valve may be detected and/or determined such that operation of the diaphragm may be monitored. A sensor included in the valve may generate sensor data that may be used to monitor the position of the diaphragm, which in turn may be used to determine a flow of a fluid through the valve. In this way, the sensor may be used to determine whether the diaphragm is properly functioning, may be used to identify and detect failures of the diaphragm, and/or may be used to quickly terminate operation of an associated deposition tool. This may reduce semiconductor substrate scrap, may reduce device failures on semiconductor substrates that are processed by the deposition tool, may increase semiconductor processing quality of the deposition tool, and/or may increase semiconductor processing yields of the deposition tool.