AlGaN Interlayer for Sharp Rare Earth Nitride Interfaces

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Solution Overview

Problem

The challenge lies in achieving a sharp and stable interface between rare earth nitrides (RENs) and group III-nitrides during epitaxial growth, which is currently hindered by the segregation of group III elements, leading to deteriorated structural quality of REN layers.

Innovation Solution

Incorporating an AlzGa1-zN interlayer with a high Al composition (1≥z≥0.8) between the rare earth nitride layer and the AlxGa1-xN or InyGa1-yN layer or substrate, ensuring direct contact and facilitating a sharp interface, thereby enhancing the structural quality of the REN layer grown on group III-nitride surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If epitaxial growth of REN on group III-nitride surface is performed, then structural quality and crystallinity can be improved, but group III element segregation occurs at the surface leading to interface deterioration

Engineering Contradiction:
Improveinterface sharpnessVSAvoidinterface composition stability
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

An AlN interlayer is introduced as an intermediary between the rare earth nitride (REN) layer and the group III-nitride layer. This interlayer acts as a mediator that prevents direct contact between REN and group III elements, thereby eliminating segregation at the interface while maintaining sharp interface boundaries and structural quality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The interface structure is segmented into three distinct layers: the REN layer, the AlN interlayer, and the group III-nitride layer. This segmentation separates the incompatible REN and group III-nitride materials, preventing harmful interactions while preserving the benefits of epitaxial growth for both materials.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If AlN interlayer is inserted between REN and group III-nitride, then interface sharpness and structural quality are improved, but device complexity increases

Engineering Contradiction:
Improveinterface sharpnessVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The AlN interlayer is applied locally only at the critical interface region between REN and group III-nitride, rather than throughout the entire device structure. This localized application provides the necessary interface quality improvement while minimizing the increase in overall device complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The presence of the AlzGa1-zN interlayer allows for the attainment of a sharp REN-group III-nitride interface, resulting in higher structural quality and improved epitaxial growth of REN layers, as demonstrated by reduced surface roughness and enhanced crystallinity.

Implementation Method 1

a group III element, (for example gallium) can segregate at the surface during growth of the REN on the group III-nitride surface producing a diluted and complex REN-group III-nitride interface

Methodology Applied
Scientific EffectSegregation:

Implementation Method 2

the recent demonstration that this new class of ferromagnetic materials is epitaxy-compatible with group III-nitrides

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Data Source

PatentUS10043871B1Rare earth nitride and group III-nitride structure or device
Publication Date: 2018.08.07 VICTORIA LINK LTD
  • US10043871B1 patent drawing
  • US10043871B1 patent drawing
  • US10043871B1 patent drawing

AI summary

Structure or device comprises a AlxGa1-xN or InyGa1-yN layer or substrate, a rare earth nitride epitaxial layer, and an AlzGa1-zN epitaxial interlayer between the rare earth nitride epitaxial layer and the AlxGa1-xN or InyGa1-yN layer or substrate. The interlayer is in direct contact with the rare earth nitride epitaxial layer and the AlxGa1-xN or InyGa1-yN layer or substrate.