AlGaN Semiconductor Layer Mg Distribution Control

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Solution Overview

Problem

Semiconductor devices face challenges in achieving stable characteristics due to issues with crystal quality and unintended mixing of magnesium (Mg) in nitride semiconductor layers, which affect the performance and reliability of devices like High Electron Mobility Transistors (HEMTs).

Innovation Solution

The semiconductor device incorporates a first semiconductor layer of Alx1Ga1-x1N, a second semiconductor layer of Alx2Ga1-x2N with a higher aluminum composition, and a third semiconductor layer containing magnesium (Alx3Ga1-x3N) with controlled Mg concentration, along with a specific insulating member configuration, to stabilize the crystal quality and prevent unintended Mg mixing, thereby enhancing the device's characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If magnesium (Mg) is added to nitride semiconductor layers to achieve normally-off characteristics, then device functionality is improved, but unintended Mg mixing occurs which degrades crystal quality

Engineering Contradiction:
Improvenormally-off characteristicsVSAvoidcrystal quality
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

An AlGaN layer with aluminum composition ratio of 0.05 to 0.30 is introduced as an intermediary layer between the GaN layer and the Mg-doped AlGaN layer. This intermediary layer prevents unintended Mg mixing into the GaN layer while still allowing the Mg-doped layer to provide normally-off characteristics, thus resolving the contradiction between device functionality and crystal quality.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If aluminum composition ratio is increased to prevent Mg diffusion, then Mg mixing is reduced, but device performance may be compromised

Engineering Contradiction:
ImproveMg distribution controlVSAvoiddevice performance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The aluminum composition ratio in the intermediary AlGaN layer is precisely controlled within the range of 0.05 to 0.30. This parameter optimization allows the layer to effectively suppress Mg diffusion while maintaining good crystal quality and device performance, achieving a balance between Mg distribution control and device reliability.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If multiple semiconductor layers are stacked to control Mg concentration, then crystal quality is improved, but device structure becomes more complex

Engineering Contradiction:
Improvecrystal qualityVSAvoidlayer structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The semiconductor device is segmented into multiple functional layers: a GaN layer, an AlGaN layer with specific aluminum composition (0.05 to 0.30), and an AlGaN layer with higher aluminum composition (0.30 to 0.60) that contains Mg. This segmentation allows each layer to perform its specific function in controlling Mg distribution while maintaining overall device performance.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11444189B2Semiconductor device and method for manufacturing the same
Publication Date: 2022.09.13 KK TOSHIBA
  • US11444189B2 patent drawing
  • US11444189B2 patent drawing
  • US11444189B2 patent drawing

AI summary

According to one embodiment, a semiconductor device includes first, second, and third electrodes, first, second, and third semiconductor layers, and a first insulating member. The first semiconductor layer includes first, second, third, fourth, and fifth partial regions. A direction from the first partial region toward the second partial region is along a first direction. The first electrode includes a first electrode portion. A direction from the first electrode portion toward the second electrode is along the first direction. A second direction from the third partial region toward the third electrode crosses the first direction. The second semiconductor layer includes a first semiconductor portion and a second semiconductor portion. At least a portion of the first semiconductor layer is between the third and second semiconductor layers. The first insulating member includes a first insulating portion. The first insulating portion is provided between the third partial region and the third electrode.