Aligned Die Attachment Structure for Stress-Free Sensor Positioning
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Solution Overview
Problem
Orientation-sensitive electronic dies, such as magnetometers and accelerometers, face misalignment issues due to the viscosity of die-attach materials, leading to inaccurate measurements and mechanical stress from thermal expansion when fixed on all sides.
Innovation Solution
The use of a die-aligning element with a single or multiple die-alignment walls that allows the die to be perfectly aligned without fixing it on opposite sides, utilizing capillary and surface-tension forces to correct initial misalignments as the die-attach material solidifies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the die is fixed on all sides with die-attach material, then the die is securely attached to the support, but the die is subjected to mechanical stress from thermal expansion and misalignment due to material viscosity
Solution Approach 1:
The patent divides the die-attachment function into two separate elements: a die-attach material for securing the die to the support, and a die-aligning element with alignment walls for positioning the die. This segmentation allows each element to perform its specific function without interfering with the other, resolving the contradiction between secure attachment and measurement accuracy.
Solution Approach 2:
The die-aligning element acts as an intermediary between the die and the support structure. It provides a reference framework that guides die placement and maintains alignment during the attachment process, preventing misalignment caused by die-attach material viscosity while allowing the material to perform its bonding function.
2Strength
If the die is fixed on all sides, then the die is securely attached, but thermal expansion of surrounding structures subjects the die to mechanical stress
Solution Approach 1:
By separating the attachment function (die-attach material) from the alignment function (die-aligning element), the patent allows the die to be securely attached while leaving portions of the die unfixed. This reduces the transmission of mechanical stress from thermal expansion of surrounding structures to the die itself.
Solution Approach 2:
The die-aligning element provides alignment constraints only at specific locations (along the alignment walls) rather than constraining the entire die perimeter. This localized constraint approach maintains attachment strength where needed while reducing mechanical stress on the die by leaving other areas free to accommodate thermal expansion.
3Strength
If die-attach material with viscosity is used to attach the die, then the die is securely bonded, but the die rotates and misaligns before solidification
Solution Approach 1:
The die-aligning element with its alignment walls is prepared in advance on the support structure to define the precise position and orientation of the die. When the die is placed on the die-attach material, the alignment walls guide it into the correct position before the material solidifies, preventing rotation and misalignment while maintaining bonding strength.
Solution Approach 2:
The die-aligning element serves as an intermediary reference structure that mediates between the die-attach material and the die. It provides physical boundaries (alignment walls) that constrain die placement and prevent rotation during the bonding process, ensuring manufacturing precision while allowing the die-attach material to perform its bonding function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the risk of mechanical stress and ensures accurate directional and positional alignment of the die, enhancing the durability and performance of the electronic component.
Implementation Method 1
utilizing capillary and surface-tension forces to correct initial misalignments as the die-attach material solidifies
Implementation Method 2
utilizing capillary and surface-tension forces to correct initial misalignments as the die-attach material solidifies
Data Source
Figure 1a~1b
Figure 2a~2d
Figure 2e~2g
AI summary
The disclosure relates to an electronic component comprising a first die (21), a support with a die-attachment surface (22) and a die-aligning element (241) which is adjacent to the die-attachment surface (22). The die-aligning element (241) comprises a first die-alignment wall, and a first side of the first die (21) is horizontally fixed to the first die-alignment wall with a die-attach material (23). The side of the first die (21) which is opposite to the first side of the first die (21) is horizontally unfixed.