Thermal interface materials comprising aligned fibers and materials such as solder, alloys, and/or other metals
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Solution Overview
Problem
Current thermal interface materials have low thermal conductivity, making them inefficient in dissipating heat from semiconductor devices, which can lead to damage and require improvements for better thermal communication between heat sources and sinks.
Innovation Solution
A composition of substantially aligned discontinuous fibers, such as carbon fibers, combined with a metal like solder, where at least 30 vol % of the fibers are aligned, and the metal has a melting temperature of no more than 265°C, enhancing thermal conductivity and preventing metal flow by forming carbides and diffusing into fibers for improved contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal interface materials are used, then the material structure is simple and easy to manufacture, but the thermal conductivity is low making them inefficient in dissipating heat
Solution Approach 1:
The patent applies composite materials by combining carbon fibers with metal particles (such as solder, aluminum, or copper) embedded within a polymer matrix. This composite structure achieves high thermal conductivity through the synergistic effect of carbon fibers providing thermal pathways and metal particles filling voids and enhancing contact, while the polymer provides structural integrity. The composite approach resolves the contradiction by delivering superior thermal performance without excessive complexity, as the materials are integrated through established manufacturing processes.
Solution Approach 2:
The patent implements local quality by creating regions of high thermal conductivity specifically where needed - embedding metal particles preferentially at fiber-fiber contact points and fiber-matrix interfaces. This localized concentration of thermally conductive materials optimizes heat transfer pathways without requiring the entire material structure to be complex. The metal particles are strategically positioned to bridge gaps and enhance thermal communication at critical locations, resolving the contradiction between thermal performance and structural simplicity.
2Ease of manufacture
If metal with low melting temperature is used, then the metal can be easily applied and processed, but the metal may flow or deform under heat
Solution Approach 1:
The patent applies parameter changes by carefully selecting metal particles with melting temperatures in the range of 90-265°C, which allows easy processing and application through melting and infiltration, while the resulting solidified metal provides sufficient structural stability. The polymer matrix is also selected with specific glass transition and decomposition temperatures to ensure it remains stable during metal infiltration and during device operation. This parameter optimization resolves the contradiction between ease of manufacture and compositional stability.
Solution Approach 2:
The patent uses the polymer matrix as an intermediary that facilitates the application of low-melting-point metals while preventing their deformation. The matrix provides a confining structure that holds the metal particles in place once solidified, preventing flow under operational heat. The intermediary polymer enables the use of easily processed low-melting metals while the overall composite structure maintains stability, resolving the contradiction between manufacturing ease and structural stability.
3Ease of manufacture
If discontinuous fibers are used, then the material can be manufactured more easily, but the thermal communication efficiency is reduced
Solution Approach 1:
The patent applies preliminary action by pre-aligning the discontinuous carbon fibers in a preferred orientation before embedding the metal particles and finalizing the composite structure. This preliminary alignment creates optimized thermal pathways that enhance heat communication efficiency even with discontinuous fibers. The fibers are arranged to maximize thermal conductivity in the direction of heat flow before the metal infiltration process, resolving the contradiction between manufacturing ease and thermal efficiency.
Solution Approach 2:
The patent uses metal particles as intermediaries that bridge the gaps between discontinuous carbon fibers, creating continuous thermal pathways. The metal fills the voids and contact points between fibers, mediating thermal transfer across the discontinuities. This intermediary approach allows the use of easily manufactured discontinuous fibers while maintaining high thermal communication efficiency through the metal-fiber composite network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high thermal conductivity, allowing efficient heat transport and electromagnetic interference shielding, with reduced void volumes and improved thermal contact, effectively addressing the inefficiencies of existing materials.
Implementation Method 1
the metal has a melting temperature of no more than 265° C., enhancing thermal conductivity and preventing metal flow by forming carbides and diffusing into fibers for improved contact
Data Source
AI summary
The present disclosure is generally directed to a variety of thermally conductive materials for use in semiconductor devices or other applications. In some cases, the materials may include aligned fibers such as carbon fibers, e.g., defining a substrate, and a metal such as solder. In some cases, the metal may be present within a transition metal rich solder alloy, a conductive medium such as a conductive ink, a thermal chemical vapor deposited solder, an oxide coated liquid metal, an oxide coated liquid metal transition metal rich solder alloy, etc. The metal may have a relatively low melting temperature in certain embodiments. The metal may be interspersed or infiltrated between the plurality of discontinuous fibers, and/or surround at least some of the fibers. In some cases, the metal may react with the carbon fibers to form metal carbides and/or diffuse into the carbon fibers, which may facilitate contact between the metal and the carbon fibers. Other aspects are generally directed to devices using such compositions, methods of making such compositions, kits including such compositions, or the like.