Aligned LED Package for Uniform Color Emission and Heat Dissipation
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Solution Overview
Problem
Conventional emitter packages suffer from non-uniform color emission at different viewing angles, loss of color fidelity, and inadequate heat dissipation due to insufficient mass and surface area of leads, leading to potential component degradation and glare issues.
Innovation Solution
The development of emitter packages with linearly aligned light emitting diodes (LEDs) and a conductive lead frame that allows for improved current control, rigidity, and waterproof operation, featuring a casing with a cavity and integral lead frame for enhanced heat dissipation and uniform light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If LEDs are arranged in a cluster at or near the center of the package, then the package can be compact and easy to mount, but the emission uniformity deteriorates at different viewing angles
Solution Approach 1:
The patent segments the LED cluster into multiple individual LED elements (red, green, blue LEDs) that are spatially separated and independently controllable. This segmentation allows each LED to be positioned optimally for its color emission characteristics while maintaining overall package compactness, resolving the contradiction between easy mounting and emission uniformity.
Solution Approach 2:
The patent applies local quality by assigning different spatial positions to different colored LEDs within the package. Each LED is positioned to optimize its specific color emission at various viewing angles, with the red LED positioned to minimize red leakage and other LEDs positioned similarly for their respective colors, thereby achieving uniform overall emission.
2Ease of manufacture
If conventional lead materials and mounting materials are used, then the package can be simple to manufacture, but color fidelity deteriorates due to reflective characteristics
Solution Approach 1:
The patent changes the optical parameters of the mounting materials by selecting materials with specific reflective properties that minimize unwanted light reflection and glare. The lead frame and mounting materials are chosen to have low reflectivity in the visible spectrum, preventing color distortion while maintaining manufacturing simplicity.
3Illumination intensity
If high power LEDs are used to increase brightness, then illumination intensity improves, but heat generation increases requiring additional thermal management components
Solution Approach 1:
The patent merges the electrical lead frame with the thermal management function by designing the lead frame with increased mass and exposed surface area. This combined structure serves both electrical connection and heat dissipation purposes, eliminating the need for separate thermal management components while supporting high power LED brightness requirements.
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: electrical connection, mechanical support, and thermal management. By increasing the lead frame's mass and surface area, it becomes a universal component that handles both electrical and thermal loads from high power LEDs without requiring additional dedicated thermal management parts.
4Device complexity
If the lead frame has insufficient mass and exposed surface area, then the package structure remains simple, but heat dissipation capability deteriorates
Solution Approach 1:
The patent applies self-service by enabling the lead frame to dissipate heat through its own increased mass and exposed surface area without requiring external heat sinks or additional thermal management components. The lead frame serves itself thermally by conducting heat away from the LEDs through its extended structure, maintaining simplicity while improving heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved color uniformity across various viewing angles, enhanced current control, and effective heat dissipation, ensuring stable and reliable operation in diverse lighting applications, including LED displays and decorative lighting.
Implementation Method 1
Various thermal management strategies including conduction heat transfer are in common use. One conventional way of implementing conduction heat transfer for dissipating heat in an electronic package is to allow the heat to conduct away along the leads of the device.
Implementation Method 2
large format, full color LED video screens have become available
Implementation Method 3
individual LED panels providing image resolutions
Data Source
AI summary
A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, and increasing rigidity of the package assembly. In one embodiment, the package comprises a casing with a cavity extending into the interior of the casing from a first main surface. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of LEDs. Electrically conductive parts, separate from the parts carrying the LEDs, have a connection pad, wherein the LEDs are electrically coupled to the connection pad, such as by a wire bond. This arrangement allows for a respective electrical signal to be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.