Alignment Carrier for Multi-Chip Interconnect Precision
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Solution Overview
Problem
Existing methods for assembling multi-chip modules face challenges in achieving precise alignment and high-density interconnects between semiconductor chips, limiting performance due to bandwidth and latency constraints, while also requiring separate wiring densities for power delivery and off-module signaling.
Innovation Solution
The use of an alignment carrier with cavities and protrusions to precisely position semiconductor chips and an interconnect bridge, allowing for precise alignment and electrical/mechanical connection through reflowed solder, enabling high-density interconnects with minimal tooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional assembly methods are used for multi-chip modules, then manufacturing process is simpler, but alignment precision of chip-to-chip interconnects is insufficient
Solution Approach 1:
An alignment carrier is introduced as an intermediary component between the chips and the assembly process. The carrier includes a support plate with cavities that receive protrusions from each chip, providing precise mechanical alignment. This mediator enables sub-micron alignment precision without requiring complex direct chip-to-chip alignment mechanisms.
Solution Approach 2:
The alignment carrier pre-establishes the geometric relationships and alignment references before the actual chip assembly. The cavities and protrusions are pre-configured to define precise relative positions, and alignment marks are pre-positioned on the support plate. This preliminary preparation eliminates the need for complex real-time alignment adjustments during assembly.
2Productivity
If high density interconnects are implemented with close chip-to-chip placement, then bandwidth and performance are improved, but assembly precision requirements become more stringent
Solution Approach 1:
The alignment carrier serves as a precision intermediary that decouples the high-density interconnect requirement from the assembly difficulty. By providing mechanically rigid cavities and protrusions with tight tolerances, the carrier enables close chip placement (high density) while maintaining achievable alignment precision through its pre-configured geometric constraints.
3Reliability
If separate wiring densities are used for power delivery and off-module signaling, then impedance matching is improved, but interconnect complexity increases
Solution Approach 1:
The alignment carrier enables different wiring densities to be implemented in different local regions. The support plate can be designed with varying cavity densities - higher density in regions requiring high-speed signaling and lower density in power delivery regions. This local differentiation allows optimized impedance matching for each function without requiring a completely complex interconnect architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise alignment and rapid assembly of high-density interconnects between semiconductor chips, enhancing performance by improving chip-to-chip interconnects and reducing assembly complexity.
Implementation Method 1
electrically and mechanically connecting the interconnect bridge contacts to the interconnect contacts of the first and second semiconductor chips by reflowing solder between the interconnect bridge contacts and the interconnect contacts of the first and second semiconductor chips
Data Source
AI summary
Place a first semiconductor chip onto an alignment carrier with protrusions of the semiconductor chip inserted into corresponding cavities of the alignment carrier, so that the protrusions and cavities locate the semiconductor chip with interconnect contacts overlying a window that is formed through the alignment carrier. Place a second semiconductor chip onto the alignment carrier with protrusions of the second semiconductor chip inserted into cavities of the alignment carrier, so that the protrusions and cavities locate the second semiconductor chip with interconnect contacts of the second semiconductor chip adjacent to the interconnect contacts of the first semiconductor chip and overlying the window. Fasten the semiconductor chips to the alignment carrier. Touch contacts of a interconnect bridge against the interconnect contacts of the first and second semiconductor chips by putting the interconnect bridge through the window.