Alignment Mark Feedback Calibration for Semiconductor Overlay Accuracy
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Solution Overview
Problem
Changes in the semiconductor process cause the optimized alignment and overlay recipe parameters to become inapplicable, affecting yield and throughput.
Innovation Solution
A semiconductor manufacturing apparatus and method that automatically adjusts alignment and overlay recipe parameters in real time based on measured position and quality data of alignment marks, using a control device to calibrate these parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment and overlay recipe parameters are optimized initially, then overlay accuracy is improved, but when process changes occur, the parameters become inapplicable causing yield and throughput to decrease
Solution Approach 1:
The patent implements a feedback mechanism where the measuring device continuously measures alignment marks and provides position data and quality data back to the control device. The control device uses this feedback to automatically adjust and recalculate alignment and overlay recipe parameters in real-time, ensuring parameters remain applicable despite process changes while maintaining overlay accuracy
Solution Approach 2:
The patent transforms static, pre-optimized parameters into dynamic parameters that can adapt to changing process conditions. The control device continuously updates alignment and overlay recipe parameters based on real-time measurements from the measuring device, allowing the system to maintain optimal performance under varying process conditions without manual intervention
2Adaptability or versatility
If manual recalibration of parameters is performed after process changes, then parameter applicability is restored, but yield and throughput decrease due to process interruption
Solution Approach 1:
The patent implements a self-service system where the control device automatically detects process changes through quality data from the measuring device and autonomously recalibrates alignment and overlay recipe parameters without requiring manual intervention. This automatic self-adjustment maintains parameter applicability while preventing yield and throughput decreases that would result from manual recalibration interruptions
Solution Approach 2:
The patent ensures continuous operation by implementing real-time parameter adjustment during the semiconductor manufacturing process. The measuring device continuously measures alignment marks and the control device continuously updates parameters, eliminating the need to stop production for manual recalibration and maintaining continuous yield and throughput
3Manufacturing precision
If real-time parameter adjustment is implemented, then overlay accuracy is maintained under process changes, but device complexity increases
Solution Approach 1:
The patent achieves real-time parameter adjustment by integrating multiple functions into existing semiconductor manufacturing equipment. The measuring device performs both its primary measurement function and the additional function of providing quality data for parameter calibration. The control device integrates parameter calibration functionality alongside its existing control functions, maintaining overlay accuracy without requiring entirely separate dedicated systems for each function
Data Source
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AI summary
A semiconductor manufacturing apparatus and a parameter adjustment method thereof are provided. Before a process device (114) performs a patterning process, an alignment mark of a wafer is measured to generate position data and quality data of the alignment mark. An alignment recipe parameter used by the process device (114) to perform the patterning process and wafer bonding and an overlay recipe parameter used by a measuring device (112) to measure a relative position of the alignment mark of the wafer are calibrated based on the position data and the quality data.