Alignment Holder for Precise Bond Strength Testing of Composite Specimens
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Solution Overview
Problem
The interface between resin and inserting components in molded electronic parts experiences high residual stress due to cure shrinkage and thermal expansion mismatch, leading to delamination, which affects the reliability and durability of semiconductor devices.
Innovation Solution
A testing apparatus and method are developed to measure the bonding strength of composite specimens, including semiconductor packages, using an alignment holder and force applying bar to apply precise forces and adjust clamping positions, allowing for accurate evaluation of bonding interfaces between different materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin is used to encapsulate semiconductor devices, then protection and insulation are improved, but delamination occurs due to residual stress and thermal expansion mismatch
Solution Approach 1:
The patent applies preliminary action by performing bonding strength testing at the wafer level before dicing and packaging. This early detection allows identification of delamination-prone interfaces before final product assembly, enabling preventive measures to be taken while the issue is still detectable and manageable at the wafer stage.
Solution Approach 2:
The patent replaces complex mechanical delamination testing that would require complete device assembly with a simplified wafer-level testing method. By testing at the wafer level, the system substitutes a less invasive mechanical testing approach that can be performed on multiple devices simultaneously without requiring individual packaging and assembly.
2Productivity
If wafer-level testing is implemented, then testing efficiency is improved, but testing precision may be compromised due to limited access to bonding interfaces
Solution Approach 1:
The patent applies universality by designing a testing apparatus that can handle multiple wafers and perform various types of bonding strength tests (pull-off, shear, flexural) using the same basic platform. The alignment holder and force applying bar system provides a universal solution that works across different wafer sizes and bonding interface configurations, maintaining precision while enabling high-throughput testing.
Solution Approach 2:
The patent introduces an intermediary alignment holder that facilitates precise positioning and force application at the wafer level. This intermediary device acts as a mediator between the testing system and the bonding interfaces, enabling accurate force application and measurement even when direct access to interfaces is limited by the wafer structure.
3Ease of operation
If manual testing methods are used, then flexibility is improved, but human error increases and consistency decreases
Solution Approach 1:
The patent implements self-service by designing an automated alignment and testing system where the alignment holder automatically positions the force applying bar, and the system self-regulates the testing process. This reduces reliance on manual operator skill and judgment, minimizing human error while maintaining operational flexibility through programmable test parameters and configurations.
Data Source
AI summary
An alignment holder for holding a composite specimen includes a holder body and a positioning mechanism. The holder body is configured to clamp a first side of the composite specimen therein. The positioning mechanism is movably engaged with the holder body. The positioning mechanism is configured to lean against a second side of the composite specimen and move relatively to the holder body for adjusting a clamping position of the composite specimen clamped by the holder body.