Alignment Mark Recognition Camera Positioning

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Solution Overview

Problem

Existing methods for recognizing alignment marks in printed wiring board manufacturing are inefficient, particularly in minimizing camera travel distance and ensuring accurate positioning of marks for precise image capture, which affects the accuracy and speed of the recognition process.

Innovation Solution

A method that involves preparing a substrate with multiple alignment marks positioned adjacent to each other, where a recognition camera captures images by adjusting its position to ensure each mark is equidistant from the camera's center, allowing for simultaneous capture of multiple marks to reduce recognition time and maintain accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the camera captures images of multiple alignment marks positioned adjacent to each other without adjusting position, then the capture process is simple and fast, but the image distortion increases and measurement precision deteriorates

Engineering Contradiction:
Improvealignment mark position measurement precisionVSAvoidcamera positioning complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The camera position is adjusted in advance before capturing images of multiple alignment marks. By positioning the camera such that each alignment mark is equidistant from the center of the image-capturing region, the system preliminarily establishes optimal imaging conditions, thereby reducing image distortion and improving measurement precision without requiring complex real-time adjustments during capture

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system changes the camera's positional parameters to optimize image capture. Specifically, the camera position is adjusted so that alignment marks positioned adjacent to each other are captured at equivalent distances from the image center, which changes the imaging parameters to minimize distortion while maintaining a relatively simple device structure

Inventive Principle:
Principle #35Parameter changes

2Productivity

If the camera travels to capture each alignment mark individually, then the measurement precision is maintained, but the recognition time increases

Engineering Contradiction:
Improvealignment mark recognition speedVSAvoidalignment mark position measurement precision
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The system merges the capture of multiple alignment marks into a single imaging operation. By adjusting the camera position to capture multiple alignment marks positioned adjacent to each other simultaneously, with each mark equidistant from the image center, the recognition process is accelerated without sacrificing measurement precision, as all marks are captured under optimized imaging conditions in one shot

Inventive Principle:
Principle #5Merging (Combining)

3Loss of time

If multiple alignment marks are captured simultaneously without position adjustment, then the recognition time is reduced, but the image distortion increases

Engineering Contradiction:
Improvealignment mark recognition timeVSAvoidalignment mark position accuracy
Core Design Contradiction:
Loss of timeVSManufacturing precision

Solution Approach 1:

Before capturing images of multiple alignment marks simultaneously, the camera position is preliminarily adjusted to ensure each mark is equidistant from the image center. This preliminary positioning action enables simultaneous capture of multiple marks while maintaining minimal image distortion, thus reducing recognition time without compromising position accuracy

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The camera's positional parameters are changed to optimize simultaneous capture of multiple alignment marks. By adjusting the position so that each mark is captured at an equivalent distance from the image center, the system changes imaging parameters to minimize distortion while achieving fast simultaneous recognition, thereby reducing time loss without sacrificing manufacturing precision

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8186050B2Printed wiring board manufacturing method
Publication Date: 2012.05.29 IBIDEN CO LTD
  • US8186050B2 patent drawing
  • US8186050B2 patent drawing
  • US8186050B2 patent drawing

AI summary

A method for recognizing alignment marks includes preparing a substrate having multiple alignment marks including alignment marks positioned adjacent to each other, and recognizing the alignment marks on the substrate by capturing images of the alignment marks using a recognition camera. The recognizing of the alignment marks includes adjusting the position of the recognition camera when capturing images of the alignment marks positioned adjacent to each other such that each of the alignment marks positioned adjacent to each other is positioned equidistant from the center of an image-capturing region of the recognition camera.